18 years of experience in PCB Layout Design, library and components creation, schematic entry, design verification, documentation, and knowledge of the processes for the production and assembly of complex board in multi-layer technology, high density SMD and TH, and mixed technology.Technical knowledge on the problems of signal/power integrity and EMI/EMC.Skill and Experiences in analisys and simulation of the Signal Integrity e Power Integrity.SKILLS and EXPERIENCESHigh Speed Digital Board, FPGA and Microprocessors, DDRx Memory, High Speed Interface (Ethernet, PCIe, SATA, RS485, USB, SERDES, etc...), Video device (DVI, HDMI), Controlled impedance, Differential pairs/matched lengths/crosstalk and HDI - High Density components and tracks. Stack-up design.Board with high currents and high voltages, Power Switching, Power Supply, Led Driver and Board HV up to 2000V (AC, DC).Analog Board for High Power, acquisition devices and data conversion, circuits with low levels, and high sensitivityBunr-In Board PCB Design, D.U.T. Mother Board /Daughter Board, Adaptor e Interface Board, Probe Card, Schematic Entry.PCB TECHNOLOGIES- Building: High density of components and tracks (28+ Layers), uBGA 0.4mm pitch design experience, Fine pitch/microvia/laser micro vias, Blind and Buried Vias, Flex e Rigid-Flex board, Stack-up design, Via-in-pad / Stacked Staggered technology, Silver Epoxy filled via, Knowledge for high temperature materials.- Assembly: Experience in the pcb design for solderability BGA devices (fine pitch uBGA), QFP QFN, TQFP, SOIC, PLCC and SOIC. VOID control for metal slug, and components designed according to IPC Standard.APPLICATIION: Industry, Military, Consumer electronics, Medical, Aerospace, Communication, Automotive, Semiconductors.Experience with the following tools:- Visula, CADSTAR and Board Designer- Mentor PADS, DxDesiger, Hyperlynx, Expedition, CAM350- Orcad Allegro- Ansys SIWAVE e HFSS- Solidworks, Autocad