Luigi Antuono Email & Phone Number

Milan

As an electrical engineer at AGADE, my main focus is designing printed circuit boards (PCBs) for modern exoskeleton technology. My main area of expertise is on the intricate layout design of printed circuit boards (PCBs), using my experience to improve performance and functionality.Key Responsibilities:- Specializing in the design and layout of PCBs with a commitment to precision and efficiency in the realm of exoskeleton technology.- Working on the integration of charging functionality in the rack for the exoskeleton, a specialized enclosure that enables battery recharging and provides a safe environment to store the exoskeleton.-Collaborating closely with cross-functional teams to ensure the successful integration of electronic components into the overall system.Achievements:Responsible for a comprehensive comparative study of communication protocols for the European Innovation Council, influencing the adoption of strategic technologies for exoskeleton connectivity and helping to secure project funding.Ongoing Contributions:I am currently committed to the ongoing redesign and enhancement of current PCBs, primarily concentrating on fine-tuning the layout to satisfy the changing performance requirements of the exoskeleton architecture.Concerning my own layouts, I am actively involved in addressing electromagnetic compatibility (EMC) and electromagnetic interference (EMI).

Milano, Lombardia, Italia

As an electronics engineer intern at AGADE, I had the opportunity to manage a project aimed at improving the quality control and testing efficiency of electronic boards used within an exoskeleton through the implementation of a test system. In this position, I was responsible for the design and development of an in-circuit test (ICT) system that would allow us to more quickly and efficiently analyze the operation of electronic boards.Key Achievements:ICT system development: I was responsible for the idea, design and execution of the ICT system. This technology enabled to test two distinct boards interchangeably, greatly enhancing testing capabilities and decreasing production downtime.Main board design and development: I designed the main board that was in charge of identifying the device under test (DUT) and analyze the data taken from the DUT in order to evaluate the board's performance.Bed of Nails Design: To ensure accurate and dependable electrical connections during testing, I built a unique bed of nails structure out of through-hole pogo pins. Thanks to this, the testing techniques were more repeatable and accurate.Breakout board development: In addition to the main board, I designed two breakout boards that were integral to the testing process, providing the necessary interfaces and connections to test various board configurations.Code development: I developed the software code needed to run the ICT tester efficiently. This included coding the logic for data analysis and reporting of test results, improving automation and reducing manual intervention.Power management: I ensured the versatility of the system by designing it to be powered through a standard wall outlet (220V AC), allowing easy integration into our existing infrastructure.

Napoli, Campania, Italia

As team member I worked on Low Voltage power supply boards, validation of PCBAs and design of Latching boards for safety purpose.I studied and analized tons of datasheets for the implementation of systems in an electric racing vehicle. The tools I used go from Simetrix ( for industrial level circuit simulation) to Eagle 360 ( for layout definition of PCBs).I learned the physical principles of sensors used in the automotive and industrial environment

As an Engineering student at Neapolis Innovation Summer I spent intensive weeks learning the multiple ways to use 32-bit microcontrollers and operating modes of the Real Time Operating Systems working in ChibiOS/ChibiStudio environment. I participated in the final Hackfest challenge working on a team project with students from Italian and international environments.

Laurea Magistrale In Ingegneria Elettronica, Ingegneria Elettronica, 110 Cum Laude

Ingegneria Elettronica