Asic Design Efficiency Intern
- Established a novel reverse-engineering methodology to analyze datapath structures and conducted die-shot analysis on Apple’s M1-M4 chip- Created custom EDA workflows and scripts to generate targeted test patterns- Developed a comprehensive infrastructure to automate custom test vector generation, datapath simulation, and power analysis.- Validated methodologies on silicon using CUDA on the Blackwell GPU and competitor GPUs, including AMD’s MI250 and MI300X