Weitao Zhou Email & Phone Number

Led the IP Operations Group for Intel's Communications, Storage and Infrastructure Group (CSIG). Maintained accountability for all budgeting, program decision, and leadership of development teams for IP used in CSIG product lines comprising revenue in excess of $3B. Envisioned, developed, and deployed a business process to govern IP development aligned with the needs of the customer. Created a new vendor management model that resulted in accelerated product development cycles with a forecasted $20M savings in outsourced engineering services.

Held dual management roles as FCMBx Operations Director and Indirect Materials Development Manager. Led the launch of an operational factory and early-stage development for the strip level assembly process in Arizona, with responsibility for a $44MM capital and development budget and over 200 technical staff members. Additionally, led the supplier development activities for all Indirect Materials used in Intel’s worldwide network of Assembly/Test factories. Recognized with the TMG Excellence Award for leading the technology transfer, development and certification of the molded matrix array package assembly process for the new smartphone market, delivering final results ahead of schedule and led a key supplier in winning the Supplier Continuous Quality Improvement award in 2012 for eliminating 15% of costs while increasing the delivery and quality of indirect materials through a new supplier strategy.

Led all packaging technology development programs for Intel’s Flash Memory, Cellular/Handheld and Wireless business groups, with responsibility for over 25 programs serving 4 major business groups. Maintained accountability for the performance of over 200 employees and over $100MM in operational spending. Surpassed a global customer's performance targets by a factor of 10 for lead free flash memory packaging, resulting in the capture of a $300M sales contract and recognition from Intel’s Vice President of Flash Products. Introduced a dramatic product redesign that improved manufacturability, leading to over 700Ku in new sales. Accelerated product development through the creation of a new operational model for external package assembly.

Was the department manager for a team of 6 managers and over 125 employees engaged in quality and reliability testing of over $2.1B in annual materials sourced from over 25 global suppliers. Slashed the number of supplier excursions by leading an improvement in the company’s Supplier Quality Operating System, reducing Assembly/Test supplier factory issues by 125% within 18 months in this role. Improved the level of quality realized by the factory network by influencing executive leadership to shift over $500MM in annual substrate supplier procurement to a new vendor. Received a Division Recognition Award from the Vice President of Corporate Quality for efforts in creating a Technical Career Path for Intel's Technology & Manufacturing Group.

Led the materials and supplier development activities for polymer and substrates as part of Intel's technology transition from ceramic to organic packaging. Was responsible for several globally dispersed suppliers materials qualifications and site certifications. Performed supplier site audits, materials analyses, manufacturability studies and designed experiments as part of the materials qualification during Intel product certification for PPGA and PLGA packaged products. Was recognized with a Divisional Recognition Award in first year at Intel and promoted to group manager.

Master'S Degree, Information Technology

Bachelor Of Computer Science