Senior Technician
Current SAC ISRO Certified fabricator. FM Level MIC Assembly work at CP, Test box and Box Level for satellite subsystems. Substrate attachment by reflow process, Gold and Silver Epoxy application. CU wire and Active devices soldering on gold plated substrates and Component mounting and reflow soldering for FM/QM Level packages. 20 MIL, 10MIL, 5MIL and 1MIL GOLD wire/ribbon bonding by using parallel gap welder machine followed by NDT Testing. MMIC Chip attachment by Peak & Place TPT machine.1MIL wire bonding in MMIC to Substrate by using wedge and ball bonding machine. Documentation and Audit process for ISRO and other Defense projects. Lithography on Mask, Substrates, Duroids, LTCC and other Space qualified materials by Dry etching process in LPKF Protolaser R Machine.