Manmohan Singh
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Manmohan Singh Email & Phone Number

Technical Sales Sr Manager - WideBand Gap at Carsem (M) Sdn. Bhd.
Location: Selangor, Malaysia, Malaysia 8 work roles 1 school
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Current company
Role
Technical Sales Sr Manager - WideBand Gap
Location
Selangor, Malaysia, Malaysia
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Manmohan Singh is listed as Technical Sales Sr Manager - WideBand Gap at Carsem (M) Sdn. Bhd., a company with 1275 employees, based in Selangor, Malaysia, Malaysia. AeroLeads shows a matched LinkedIn profile for Manmohan Singh.

Manmohan Singh previously worked as Assembly Quality Engineering Manager at Texas Instruments and Process & Equipment Engineering Manager at Texas Instruments. Manmohan Singh holds Bachelor Of Engineering (B.Eng.), Electrical And Electronics Engineering (Mechatronics) from Universiti Teknologi Malaysia.

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Carsem (M) Sdn. Bhd.

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About Manmohan Singh

With over 20 years of experience in the semiconductor manufacturing and IT industries, I am a result-oriented and dedicated professional who leads the Assembly Quality Engineering team at Texas Instruments. My mission is to ensure the highest standards of quality and reliability for our products and processes, while driving continuous improvement and innovation for our customers and stakeholders.As the Quality Lead for plantwide automation projects, I leverage my process knowledge and quality mindset to optimize tool utilization, eliminate human errors, and enable early detection of quality issues. My core competencies include Process Improvement, Quality Management and Process Simplification.

Listed skills include Process Management, Process Engineering, Process Improvement, Failure Analysis, and 11 others.

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Carsem (M) Sdn. Bhd.
Carsem (M) Sdn. Bhd.
Technical Sales Sr Manager - WideBand Gap
Selangor, Malaysia
Website
Employees
1275
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8 roles · 15 years

Manmohan Singh work experience

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Assembly Quality Engineering Manager

Current

Malaysia

  • Leading the frontend to backend assembly Quality Engineering team consisting of 5 engineers and about 30 quality operators/technicians.
  • Leveraging on process knowledge and quality mindset to continuously lead customer CIPs(Continuous improvement program) together with CQE (Customer Quality Engineering).
  • Quality lead for plantwide automation projects such as auto data upload/download to optimize tool utilization and eliminate human errors, small signals tapping for automated material disposition and decision making as.
  • Quality representative for new product review board and automotive product qualifications and releases.
  • Co-Author of TLC (Technical Leadership Conference) paper on Lifted Ball & Die delamination due to Incoming supplier material – a joint effort of cross functional teams comprising of supplier, Regional Quality team and.
Jan 2023 - Present

Process & Equipment Engineering Manager

Malaysia

  • Expanded role in managing a team of 4 process engineers and 12 technicians responsible for the die prep/prebond process.
  • Continuously leading the collaboration between the engineering and manufacturing teams on MOOI (More Out Of Installs) through engineering breakthroughs, simplification of processes and cross sites Best Practices.
  • Coordinating the prebond team on automation projects such as recipe and auto data upload/download for a more robust and flexible floor space.
  • Driving the equipment team on tool MTBA (mean time between assists) and OEU (overall equipment efficiency) through a short-range and long-range plan. MTBA improvements seen at >2x year on year from Yr2020 to Yr2021.
  • Lead for the surfactant material usage/cost reduction program at Prebond process.
  • Mentoring high achieving and capable staff for the technical ladder promotion program.
Dec 2020 - Sep 2023

Process Engineering Manager

Kuala Lumpur, Malaysia

  • Managing a team of 3 process engineers and 3 technicians responsible for the die attach process under the process engineering group, collectively achieved yield improvements of 3% year on year from 2016 to date for the.
  • Leader for the Quality Improvement Team (QIT) from 2016 to date, driving cross functional teams to meet Process KPIs, successfully bringing external quality improvement by 40%, internal quality improvement by 10% year.
  • Project Manager for the development and implementation of the Recipe Management System to improve setup time by 8% and reduce machine to machine process variation.
  • Texas Instruments Malaysia Team Lead for the Worldwide Cost team, successfully brought down scrap rate for a key commodity by 5% year on year from 2017 to 2019.
  • Led the team to reduce dispense related quality issues by 30% and improving 20% throughput on roadmap equipment from 2015 onward.
  • Led outsourcing and quality projects with multiple suppliers to drive 10% tool cost reduction while maintaining quality of products.
Oct 2014 - Dec 2020

Staff Engineer

  • Coordinating and managing process improvement activity related to the Die Attach process.
  • Provided breakthrough solutions for specific assembly related defects and quality issues.
  • Manage productivity improvement project for Die Attach and overall equipment efficiency.
  • Analysis of assembly Operation Effectiveness using statistical tools such as JMP and drive improvements in terms of process enhancements and/or equipment/hardware modifications.
  • Responsible for sourcing alternative and affordable tooling in line with continuous cost down efforts.
  • Project Manager for the development and implementation of the Parameter Management System and reviewed deployment effectiveness.
2011 - Sep 2014

Service Engineer

Kuala Lumpur, Malaysia

  • Integrated Shell Business Unit systems under a single search network to enable downstream units to correlate and share technical documentation.
  • Designed and developed search architecture and platform based on Autonomy IDOL.
  • Managed and executed specific Shell business unit requirements on Search servers (Project based) which required security enhanced features and specific user requirements.
  • Performed UAT and concurrent analysis as well as documentation for presentation to the service board.
  • Provided technical guidance and support to the Run and Maintain team (support team) upon completion of projects. This was done through the Handover Process of Production servers.
  • Led brainstorming sessions with the Engineering and Operations team on innovative ideas for service improvement, such as reduced search time and enhancement of word search relativity.
Feb 2009 - Feb 2011

Senior Quality Engineer (Failure Analysis)

Kuala Lumpur, Malaysia

  • Responsible for new product development, including product testing, quality analysis and readinessfor deployment in mass production.
  • Perform failure analysis on hard disks in development stages to determine root causes andpossible fixes.
  • Coordinate with lab and process teams to develop solutions for failed drives.
  • Manage and develop code packages for disk drive optimisation with the software developmentteam in Lake Forest, CA for continuous improvement.
  • Weekly presentation of product tests and yield, issues faced and actions taken to Asia Pac VPand Management Team.
  • Manage and coordinate junior product development team on a divide and conquer basis toenable fast turnover of analysis of hard disk drives required for mass production.
May 2008 - Jan 2009

Senior Engineer

Kuala Lumpur, Malaysia

  • Responsible to handle material and equipment suppliers on improvement/enhancement of tooling and equipment while managing cost effectiveness with the Purchasing and Supplier Department.
  • Received performance certificate of appreciation in yield performance for Intel.
  • Coordinated overall yield improvement with the engineering teams from the post Die Attach process.
  • Designed process controls and specifications based on product and customer requirements using the Statistical tools such as JMP.
  • Liaised with the Customer Support and Production teams on yield improvement as well as manufacturing efficiency.
  • Responsible to present project status for the die attach process to customers, management and internal board of directors.
Jan 2003 - May 2008
Team & coworkers

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1 education record

Manmohan Singh education

FAQ

Frequently asked questions about Manmohan Singh

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What company does Manmohan Singh work for?

Manmohan Singh works for Carsem (M) Sdn. Bhd..

What is Manmohan Singh's role at Carsem (M) Sdn. Bhd.?

Manmohan Singh is listed as Technical Sales Sr Manager - WideBand Gap at Carsem (M) Sdn. Bhd..

Where is Manmohan Singh based?

Manmohan Singh is based in Selangor, Malaysia, Malaysia while working with Carsem (M) Sdn. Bhd..

What companies has Manmohan Singh worked for?

Manmohan Singh has worked for Carsem (M) Sdn. Bhd., Texas Instruments, Stats Chippac, T-Systems, and Wd, A Western Digital Company.

Who are Manmohan Singh's colleagues at Carsem (M) Sdn. Bhd.?

Manmohan Singh's colleagues at Carsem (M) Sdn. Bhd. include Nur Era Leily Mohd Ashri, Abby Halim, Hazman Hakim, William William, and Mohamad Faredzuan.

How can I contact Manmohan Singh?

You can use AeroLeads to view verified contact signals for Manmohan Singh at Carsem (M) Sdn. Bhd., including work email, phone, and LinkedIn data when available.

What schools did Manmohan Singh attend?

Manmohan Singh holds Bachelor Of Engineering (B.Eng.), Electrical And Electronics Engineering (Mechatronics) from Universiti Teknologi Malaysia.

What skills is Manmohan Singh known for?

Manmohan Singh is listed with skills including Process Management, Process Engineering, Process Improvement, Failure Analysis, Manufacturing Engineering, R&D, Quality Assurance, and Supplier Negotiation.

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