Process design responsible: design and development of new methods of graphene integration in scalable manufacturing for photonics application.

Research interests: fabrication and characterization of photonic and optoelectronic components for the Silicon Photonics, Graphene transfer techniques, Silicon photonics graphene integration

My work is based on the study of the optical properties of the graphene in order to build a Graphene mixer for optical frequency conversion.Main outcomes:• Development of novel processes for advanced graphene optoelectronic devices fabrication and testing• Strong skills in microscopy and spectroscopy characterisation methods (i.e. Raman, SEM, AFM).• 4 papers published in peer-reviewed scientific journals

Nominated as Student's SIOF Coordinator with the aim to promote nationally reaserch and activity in the Optic and photonics field.

In this project an advanced platform for the optical characterization of nanophotonic circuits was developed.The platform is based on recent advances in high-performance single photon detector development at KIT exploiting superconducting nanowires. The project is concerned with the implementation of the experimental setup. It is carrying out under supervision of Dr. Wolfram Pernice at the Institute of Nanotechnology at the Karlsruhe Institute of Technology (KIT). The project is embedded in a larger effort in Optics and Photonics at the INT.Frequent interaction with other researchers and doctoral investigators contributed to the success of the project. The project is embedded in a frontier research effort at KIT to implement novel imaging and spectroscopic methods for nanophotonic circuit design. The unique combination of advanced detector design with spatially and temporally high resolution imaging gives rise to a powerful platform for the design and implementation of next-generation photonic circuits.

Participation to the research activity of the Laboratory in the field of new generation optical coatings. Investigation the properties of thin-film materials by attenuated total reflection and total internal reflection ellipsometry and realizing also multilayer structures containing both dielectric and metal films, by the sputtering deposition technology, in the frame of the laboratory programs.Some of the results of this work have already been presented at international conferences.