Creating hardware for the first time, especially if it has never been done before.See my site, www.ideasintohardware.com

Designing and building large infrastructure of moving and stationary Lidar test targets, Gimbals, Ranges, Test surfaces, Electronic Motorized Controls and Optical Feedback Systems. Mechanical/electronic control, support for other teams. Machine Shop Skills. Managed two technicians.

Integration Engineer: Combining optical, electronic and mechanical skills to design and build large optical infrastructure, including: laser guided target car, Remote controlled two target lift, 60 meter perpendicular/parallel target elignment tool with 11 axsis of freedom, 70 pound mirror gimbal, DUT Gimbal and stages, Burn-in rack power distribution, Daylight test system for oven, NFA target system, Calibration target system, Robot target system, 80 meter long targets, adjustable radius arcs, Motorized and pneumatic lift systems. Designed 85% Lambertian low cost target materials.

Served as engineering consultant for several projects: Spring 2006; Created wiring interface for external test and diagnostics of software, including finished test interface box. Summer 2004; Worked on upgrading ashing chamber equipment in clean room. Ran long-term reliability testing for internal vacuum temperature sensors. Developed solutions for high vacuum sensors. Spring 2001; Designed and built safety, sensing and control systems for super critical fluids process lab. Designed and built stand-alone wafer insertion robot for SCF chamber. Robotics. Analog electronics. Digital system controls. January 2000 - October 2000; Built stand-alone hardware systems test stand for early machine software development. Built full size foam, metal and wood models of wafer process equipment for human servicing and ergonomics. Assisted in development and cycle testing of vacuum linear actuator. Modeling. Data acquisition. Teaching. Summer 1994 and Summer 1996; Developed system control for wafer fabrication capital equipment process load lock chambers. Included full revamp of wiring harness and SOIC box terminations. For two generations of machines. System control. Pneumatics. Power distribution. Wafer Edge Detection.