Marek Turowski Email & Phone Number

* In-depth knowledge and understanding of semiconductor device physics of a broad range of semiconductor technologies, including CMOS, Bipolar, BiCMOS, high-voltage and power devices, FinFETs, SOI, SiGe, III-V, HBTs, HEMTs. * Over 25 years of experience in modeling, simulation, and multi-domain (electrical, thermal, and optical) analysis, optimization, and characterization of semiconductor devices and ICs: Si, SiGe, III-V, power devices, optoelectronic/photonic and high-frequency/RF devices.* Radiation effects in semiconductor devices and ICs: single-event effects (SEEs), single-event upsets, soft errors, total ionizing dose (TID), and displacement damage (DD). Deep knowledge of radiation effects on all levels, from detailed physics to devices to circuits to soft error rates (SER). * Over 15 years of demonstrated technical leadership and project management experience.* Knowledge of integrated circuit (IC) fabrication process, reliability issues and physics.* Over 15 years of extensive hands-on experience with TCAD Process and Device simulation tools.* Familiar with Layout tools, DRC, LVS, and parasitics extraction.* Circuit simulation tools (Spice, and similar); knowledge of many Spice/compact models.* Co-author of over 200 technical papers.Publications: http://scholar.google.com/citations?user=nsJqhZsAAAAJ&hl=enSpecialties: Physics of semiconductor devices, reliability, modeling, simulation, TCAD, radiation effects, thermal issues, extreme environments

Listed skills include Simulations, Semiconductors, Physics, Ic, and 21 others.

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  Technical University Of Lodz

  Electronics Engineering