Marie W. Email and Phone Number

▪ Hybrid Memory Cube (HMC) & DDR4 3D Through-Silicon-Via (TSV) IC package development▪ Constructing new pkg material/structure evaluation DOE for pkg performance improvement▪ Enabling wafer back-end RDL fabrication process & downstream assembly collaboration▪ Designing & validating high performance multi-chip memory package thermal solution▪ Strategizing new package implementation approach (product qualification & production line bring-up)Publication:"Thermal… Show more ▪ Hybrid Memory Cube (HMC) & DDR4 3D Through-Silicon-Via (TSV) IC package development▪ Constructing new pkg material/structure evaluation DOE for pkg performance improvement▪ Enabling wafer back-end RDL fabrication process & downstream assembly collaboration▪ Designing & validating high performance multi-chip memory package thermal solution▪ Strategizing new package implementation approach (product qualification & production line bring-up)Publication:"Thermal Performance of HMC Package" by C. Yoo, H. Ho, A. Griffin, L. Yang, J. Derderian, D. Hembree, X. Li, B. Fosbinder, A. Singh, in 2016 Micron–TLP Assembly Packaging Systems Symposium"Investigation of Wafer Backside Film Stress on Warpage" by W. Huang, H. Ho, C. Tiwari, in 2016 Micron–TLP Assembly Packaging Systems Symposium Show less

▪ Perform IC component level thermal analysis for package structure/material selection▪ Provide mobile/broadband reference thermal solution with system-level thermal modeling▪ Apply IR imaging to identify IC device silicon transient hot spot issue▪ Collaborate with OSATs and material vendors for product thermal performance enhancement: ---- Thermal interface material I (TIM I) characterization ---- Drop-in heat spreader in molded FBGA feasibility study ---- Substrate… Show more ▪ Perform IC component level thermal analysis for package structure/material selection▪ Provide mobile/broadband reference thermal solution with system-level thermal modeling▪ Apply IR imaging to identify IC device silicon transient hot spot issue▪ Collaborate with OSATs and material vendors for product thermal performance enhancement: ---- Thermal interface material I (TIM I) characterization ---- Drop-in heat spreader in molded FBGA feasibility study ---- Substrate material & coreless substrate thermal impact analysis ---- Designing IC mechanical stress test to investigate pkg damage during heat sink installation Show less

Thermal and Stress Simulation modeling for Cellular Phone Cases with SolidWork and HyperMesh