10 years at NCR's Microelectronics Division in Fort Collins, CO. Roles included QA Assembly, QA Mask making, QA Process Engineering, QA Materials Receiving, Transitioned to Process Engineering covering Lithography, Oxide and Metal Etch, Diffusion Cleans and Diffusion oxidations and depositions. I received the NCR President's Award for managing the introduction of 150mm wafer processing, equipment installs and start up of 0.25u CMOS on the 150mm wafer processing line. Later became the Process Engineering Development Manager in Fort Collins.Spent 8 years at AMD in Austin as Fab14 Thin Films Module Manager, Fab15 Etch Module Manager, Fab25 Advanced Process Control and Fab25 middle of line integration owner for technology transfers and speed targeting for the K5, K6 and K7 microprocessors. Later transitioned to 2 years at the R&D JDA with Motorola Freescale doing 90nm and 65nm gate module development.In Spansion, I was responsible for transferring the 90nm NAND Flash technology from California to Austin, TX. Also assumed the role for BEoL Copper transfer and development in Fab25.When I returned to AMD and Sunnyvale CA in 2002, I picked up Competitive Analysis, 32SOI co-development with ISDA and later the transfer of the 32SOI technology from ISDA to our Fab1 community.When GLOBALFOUNDRIES split from AMD, I transitioned to Test SIte Development Management for the different 28nm technology flavors, 20nm technology, 14nm and 10nm technologies. The role included coordination of the test site introductions with Technology program management, content management including the availability of design manuals and PDKs consistent with the goals of the test site and reconciling conflicts of priorities.