Mark Berry Email & Phone Number

Bring me to bear on your toughest problems - especially around packaging/test and NPI - Seasoned semiconductor veteran with a broad range of leadership, business & engineering and ops management skills. Broad knowledge of markets (Automotive/Industrial, Communications, Consumer & Computing), across packaging (2.x, 2.5D, 3D, WLP including WLFO & WLCSP) and products (MEMS (sensors/actuators), RF, Digital, Mixed Signal, Analog & Power). In depth understanding of IC test eq (ATE testers, probers, handlers, SLT and burn-in). Extensive experience across all phases on new product development - successful execution track record of beating schedules, coming in under budget and hitting time to money goals. Highly accomplished at leading large, global, cross functional teams both in front end (photo/etch, device) and back end (product/test eng, business management and business development). High bandwidth, multi-tasker focused on profitable growth. Believes in putting people first, customer second and manager third. Believes in contagious excitement and enthusiasm. Specialist in outsourced (OSAT) test, capital investment strategies, creation and implementation of business development strategies. Very well versed in helping a wide range of companies develop robust test strategies, helping to lower the cost of test over the product lifecycle. Skilled at distributed test strategies for complex SiP and SoC devices. Worked across all IC(s) in mobile phone - power management, DSP, MCU, RF transceivers, power amplifiers and across FSRAM, DRAM and EEPROM devices.

Listed skills include Semiconductors, Ic, Product Management, Manufacturing, and 18 others.