Mark Chiappetta Email & Phone Number

Andover, Ma, Us

Microwave/millimeterwave Transmit-side Hardware Analyses, Device Upscreening, including TID Radiation

Spacecraft and Payload Development, Integration, and Test

Generated numerous proposed (Microwave, mmWave and optical) Directional Communications arrangements in an effort to bring work into Westwind. Also helped complete Westwind’s first UAV; with 4 camera payloads is 17 Lb GTOW (1 hour Endurance).

Warminster, Pa, Us

UAV upgrades; SATCOM Payload Development, Payload integration, Wireless Link Fidelity, Mobile Ground Station and Antenna Engineering Team, Weatherization & De-Icing, Quieting, Engine-propeller load matching & Tech support to Business development.

Work is modeled, CAD'd, Fab'd, then tested under a microscope.Wideband Up/Down converters and Linearizers for 94GHz, 81-86, 71-76, 60, EHF 44GHz, Ka, Kt, Ku, and X-Band. Successful SBIR Proposals. Worked with fine management.

Bethesda, Md, Us

Comm Systems: Recommended novel SATCOM approach to Reentry FALCON HTV (Hypersonic Transport Vehicle), approach was accepted and Flown. Performed systems engineering and hardware development on 60GHz millimeterwave crosslinks, Broadband microwave filter bank payloads, the GPS III spacecraft Navigation and Crosslink payloads including particular support of the transmitters and atomic clock/timekeeping, and refinements of DOORS-based Program documents.

12-channel 30+Gbps optical module design, HDI MFG, and markets.

London, Gb

Applied to precision RWR tradeoff implementation, JSF electronics suite trades, F/A-18 RWR, F-16 fiber-fed Towed-Decoy, fiber-fed SIGINT & INTEL aircraft such as Rivet Joint & Combat-SENT

Sydney, New South Wales, Au

Led the 12-channel 30Gbps optical module design and HDI manufacture.

Assisted core team in the development of in-line optic fiber modulators.

Military and Commercial spacecraft communication subsystem and components design experience. Designed 60GHz Monoscan Converter for GEO crosslinks, HEMT frequency multipliers, 6/4 Receiver Engineering responsibility, numerous mmWave and microwave component design activities applied to ACSS, DSCS III, MILSTAR, GE-1, 2, 3+, JPL New Millennium probes, LandSat, EOS, IR&Ds and Systems Studies, UGTsHelped establish advanced mmWave packaging techniques as used in LMCO Newtown CPC.Helped develop HDI packaging for mmWave circuits as used in Draper Labs, FL.

Bsee, Microwave Theory

Bsee 1986, Microwave; Mmic Design

Education record