Mark Griswold Email & Phone Number

• Leading state of the art BCD development • Lead the development of the best in class 200V SOI BCD within manufacturing wafer fab. • Directed the development of next-generation automotive BCD 30-90V platform • Drove the development of the most advanced HVIC technology for GaN gate drivers. • Created and guided the development of reliability physics and test methods for the world’s first magnetic tunnel junction MRAM product in Freescale, Developed design MRAM reliability methods.• Drove numerous root cause analysis projects, formal DOE for process optimization, and reliability methods development which produced millions of dollars in cost improvement. Motorola• Technology leadership of the Integration of advanced MCU with eFlash into high volume manufacturing Motorola• Contributed device engineering leadership role in 8in manufacturing startup team Motorola• Led highly successful process optimization and yield enhancement of 4 generations of MCU + NVM. MotorolaSelected Areas of Expertise: Semiconductor Technology, Semiconductor Physics, Process Integration, Design Rule Development, Volume Manufacturing; Written & Spoken Communication; Budget Management; Failure Analysis; IC and parametric Test; Mentoring Reliability Physics; Problem Solving & Root Cause Analysis; New Product Introduction;

Listed skills include Semiconductors, Silicon, Semiconductor Industry, Yield, and 16 others.