Mark Hemming Email & Phone Number

San Jose, Californa, Usa (Silicon Valley/Bay Area)

As Vice President of Engineering I manage and direct corporate engineering for Nuvoton Technology Corporation America. The role includes strategic planning, product design, quality assurance and problem resolution. I ensure that product design projects are executed to meet company objectives and closely partner with management to develop systems and controls to guarantee compliance with quality standards. I oversee development of procedures and methods to ensure quality standards are met and maintained. With a financial responsibility to provide up-to-date and accurate costing I manage the general engineering budget. Design Projects are managed from design through execution; this includes recommending methods, materials and plans for improvement based on design and manufacturing constraints and capabilities. With the ability to build, develop and manage an engineering team, I ensure the capability of Nuvoton Technology Corporation America to carry out all its engineering initiatives.Other related duties include. Financial Management. Technical Capacity. Performance Management. Business Acumen. Communication Proficiency. Ethical Conduct. Leadership. Problem Solving/Analysis. Strategic Thinking

San Jose, California, Usa (Silicon Valley/Bay Area)

Director of mixed signal product line with Nuvoton Technology Corporation, a leading semiconductor manufacturing company formed from Winbond Electronics Corp in July 2008• Strategic, logistic and technical product planning for mixed signal product division• Direct all test development activities for Nuvoton America, including new test platform developments and transfers to in-house and subcon for mass production• As head of Quality for Nuvoton America. I have continued to drive automotive TS16949 compliance, hosted audits to support the automotive industry, achieved “full compliance” recognition thus providing Nuvoton access to a new market segment for worldwide sales of high quality, high ASP devices with high margin. TS3 Automotive Lead Auditor certified I have lead internal audits and advised subcontractors for audit success• Provided direction and technical leadership for new VOIP (Voice over Intellectual Property) IC product line. Developed Bench verification and characterization capability, and low cost, high quality production test capability. Devices interface telephone systems to customer developed IP. Product line has >$10M TAM and is extremely cost sensitive. Backend cost structure and high quality has enabled sales to continue to penetrate into a broad range of new telephony applications particularly in Asia regions• Audio product line introduction has provided new products while enabling our company to defend existing markets through improvements with audio IP. Responsible for all backend aspects of this new product development, including verification, test, quality and qualification. • Responsible for all new product packaging for Nuvoton America products. Working with assembly subcon for package drawings work instruction and “turnkey” solutions. New package technology includes MCP and CSP

Director of mixed signal product line with Winbond Electronics Corporation, a billion-dollar semiconductor manufacturing company with headquarters in Taiwan and offices worldwide• Direct responsibility for a team of ten senior engineers working on multiple projects. Accountable for all new product development, including first silicon debug, verification, characterization, test, release to mass production and application tool development• Implement new test methodologies, which have achieved increases for product time to production by over 50% enabling the company to capitalize on product ASP and secure new design wins• Negotiate purchase and introduction of new mixed signal ATE systems for developing product lines. These new systems are used company wide, essential for test program and test hardware transfer, speeding time to market. A cost effective test solution both to purchase and to outsource in subcon. Developed cost of ownership model for ATE comparison showing $5M saving against current systems on a single product• Implementation of Built-in self-test (BIST) for SOC devices and expansion to multi-site for production testing throughout product groups• Designed engineering lab and tooled-up for micro-probing and silicon debug. Develop bench-top de-bug and validation methodology. Arrange local support for failure analysis and quick turn assembly• Review technical data and results, write and review technical documents pertaining to product line activities• Provide company-wide training for mixed signal product line, many classes held in Taiwan• Create and maintain operating and capital budgets for fiscal year and implement cost control to ensure guidelines are maintained• Successfully recruited entire development group from the ground up attracting engineers to the company from worldwide locations, well versed in interviewing techniques and team building

Responsible for new speech product line, developed on a technology that was new to the company. Work included extensive communication with foundry services, detailed characterization both on test chip and product and implementation of test circuits for production• Designed and implemented test hardware and software for ATE used in characterization of new products• Designed and implemented bench systems for prototype silicon de-bug, systems based on PC and instrumentation using National Instruments software and Data Acquisition equipment• Part of new product de-bug team, responsible for “bringing up” first silicon and producing initial verification reports• Sustained operations for product line in a wafer-sort and final-test manufacturing environment• Tracked, monitored and analyzed data from our own test floor and from external FAB foundries. Ensured that product shipped was to customer expectations

Swindon (Uk)

Senior Product Development Engineer: Duties were to develop and sustain RF/Mixed signal products with responsibility for “special projects”• Lead an inter-company cross-site team of engineers for developing “Known Good Die” (KGD)• High speed wafer sort test development to GHz using Membrane Probe Card technology• Team leader of CIT for Bipolar FAB process improvement.• Products: ADC, DAC, Synthesizers, FM demodulators, Telecom relay drivers, Fibre optics, High frequency dividers, Wireless LAN and GPS.• Hardware and software design and optimization for manufacture.• Lead (IYM) Integrated Yield Management projects.• TQM Philosophy and working practices implemented.• Conduct Interviewing and appraisals for technical staff.• Completed Graduate-training program.

Beng (Hons), Electrical And Electronic Engineering

Nvq, Engineering Management

Btec Hnd, Electronics And Communications