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Mark Hilbert is listed as Senior Member of Technical Staff at NHanced Semiconductors, Inc. at NHanced Semiconductors, Inc., a company with 68 employees, based in Naperville, Illinois, United States. AeroLeads shows a work email signal at nhanced-semi.com and a matched LinkedIn profile for Mark Hilbert.
Mark Hilbert previously worked as Senior Member Of Technical Staff at Nhanced Semiconductors, Inc. and Senior Manager - Analog/Mixed Signal IC Design at Tezzaron Semiconductor. Mark Hilbert holds Master Of Science (Msee), Electrical And Electronics Engineering from Illinois Institute Of Technology.
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Highly skilled in mixed-signal IC design/design management. Experience includes RF analog IC, analog IC and digital IC design.- Analog IC and RF analog IC designs include 2GHz PLLs, 1-2GHz DLLs, 30Gbps SerDes (front-end, RX/TX equalization, data align/recovery, DLL), 1-2GHz LNAs & Mixers, direct-conversion receivers/transmitters (RF to baseband), 1-2 GHz fractional-N frequency synthesizers, SC circuits/filters, ADC and DAC convertors, opamps, charge pump regulators.- Digital IC experience includes asynchronous and synchronous logic design, memory design (DRAM, MRAM, SRAM, CAM), artificial intelligence processor, microcontroller design, BIST sequencer, developed DRAM test algorithms for BIST including NPSF faults, ECC design (Hamming, Reed-Solomon), verilog programming and synthesis, pre-PnR SDC constraint and LIB file generation, static timing analysis (STA). - 3D IC design experience includes a 3D IC memory with 18-layers with mixed technology nodes and more than 10 million TSVs. Designed a 2-layer, 3D IC image sensor with more than 95% fill factor.
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Naperville, IL
Principal designer and project lead for a 16nm Artificial Intelligence ASIC, which performs switch/router functions, 10-28Gbps SerDes, DDR4, PCS, MAC and PCIe4 interfaces. Developed expertise with Neural Network Processor Design/Architecture.
Naperville, IL
Principal designer/design manager for many of Tezzaron's 3D memory products, including DiRAM4, a 64Gb 16 layer DRAM memory stack with high speed controller layer, I/O layer and over 5 million TSVs. Other 3D memory ASICs included stacked ReRAM and SRAM memory. My design contributions and several key patents played a major role in Tezzaron's leadership in 3D.
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Mark Hilbert works for NHanced Semiconductors, Inc..
Mark Hilbert is listed as Senior Member of Technical Staff at NHanced Semiconductors, Inc. at NHanced Semiconductors, Inc..
AeroLeads has found 1 work email signal at @nhanced-semi.com for Mark Hilbert at NHanced Semiconductors, Inc..
Mark Hilbert is based in Naperville, Illinois, United States while working with NHanced Semiconductors, Inc..
Mark Hilbert has worked for Nhanced Semiconductors, Inc. and Tezzaron Semiconductor.
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Mark Hilbert holds Master Of Science (Msee), Electrical And Electronics Engineering from Illinois Institute Of Technology.
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