I am engaged in R&D of RFFE IC devices. Mainly responsible for the development of 5G/4G antenna switches, tuner switch, LNA and Phase7 LE/MMMB/TXM CMOS controller products.

I'm in charge of rfic product development.1.2/3/4G FEM(P2P skyworks):TR8024/TR9016/TR6043.2.130nm SOI Switch: TR373/TR472/TR414/TR415/TR416/TR418/TR492.

I was working in the power amplifier design team, mainly focus on below, 1.SOI RF switch. IBM/GSMC 0.18um 7RFSOI process, include a.SP2T, SP3T, DPDT switch module with GPIO control for 3G/WIFI application. b.SP4T — SP8T switch module for 2G/3G/4G antenna diversity or LTE application. c.SP12T, SP16T switch with MIPI control and LFP for multimode handset application. d.SP6T and SP8T switch for FEM. e.SOI RF ESD protection. 2.CMOS PA Controller. Include bandgap, LDO, ESD, comparator, logic, buffer, etc. a.GSM/EDGE/3G PA controller. SMIC/TSMC 0.35um CMOS process. b.Low cost GSM controller. SMIC/TSMC 0.35um CMOS process. c.Decoder for RF switch. SMIC/TSMC 0.35um CMOS and IBM 7RFSOI process. d.Negative voltage generator for switch. IBM/GSMC 0.18um 7RFSOI process. 3.Power amplifier (PA ) and LNA a.100MHz~2500MHz wide band and high linearity PA. WIN/Triquint 0.5um GaAS process. b.SiGe BiCMOS GSM/RFID PA. IBM 5PAE / Jazz SBC18 process c.SOI GPS LNA. IBM 0.18um 7RFSOI process. d.Low cost cmos pa.Mass productoin expericences:1. RDA SW36 SP3T RF siwtch.The major customer is Sumsang. The total shipments were more than 100kk(100000000) pcs.In charge of whole chip design, include the schematic, layout, debug, datasheet and application note.2.RDA6231 is a high-power, high-efficiency dual-band front-end Module. This device is designed for EGSM900 and DCS1800 handheld digital cellular equipment. The module consists of dual band power amplifiers and dual band antenna switch. The power amplifiers, switch and their controller are fabricated with GaAs HBT, GaAs PHEMT and CMOS respectively.Responsibilities: In charge of CMOS controller and SP6T switch design, include the schematic and layout. The SP6T switch was fabricated on a GaAs PHEMT die and the controller was fabricated on a CMOS die.Achievement: This product has been mass production. The total shipments were more than 500kk(500000000) pcs.

Working at Intel China research center, CTL group.1.Study the UWB spectral regulation technology.2. Analysis the coexistence and interference issues between UWB and FS（FSS）.3.Use Matlab to do the simulation and write the report to my mentor.