- Responsible for SETi's back-end semiconductor production line for UV-LED SMD devices- Coordinated production planing with customer delivery schedules- Ensured production processes met quality specifications and were followed according to SOPs- Performed research and DOEs on new SMD package designs and process improvements- Back-end assembly processes included wafer singulation, flip-chip die attach, reflow bonding, dispensing, lens attach, final device testing and sorting

- Responsible for Nextreme's back-end semiconductor production of thermal-electric devices- Provided process support for flip chip assembly and reflow bonding- Responsible for process setup and measurement programs to ensure high yield and quality- Designed DOEs to identify and eliminate sources of process variations and defects

- Provided technical and process support for semiconductor capital equipment in Asia Pacific- Supported high volume flip chip manufacturing processes- Conducted process evaluations and provided technical training to customers- Provided second level problem solving support to Field Service Engineers

- Provided on-site support for Cree's high volume LED sorting- Setup new processes based on Cree's manufacturing specifications- Coordinated between Cree and Besi R&D for customer specific design changes

- Provided technical and process support for semiconductor capital equipment in Asia Pacific- Supported high volume flip chip manufacturing for customers throughout Asia- Provided technical and process support for flip chip applications- Conducted process evaluations and provided technical training to customers- Provided second level problem solving support to Field Service Engineers