Ensure clients' project expectations are more than met, and that they are satisfied, happy, and confident with the services we deliver. I also make sure that my team is taken well cared of, for they are the main reason my projects can succeed. I will be only steering our team to provide better output.

2.5” Sapta15/Julius1 (5400rpm/7200rpm 320G/platter) > Yield improvement and failure analysis giving feedback to involved groups for the best possible countermeasures and preventive plans> Failure analysis for ODT/ORT and Test failures (for 2nd Generation 7mm notebook drives)> Work with the development team for any changes to improve quality and yield during the launch period

Worked in Hitachi GST Philippines and was later transferred to Hitachi GSP, Shenzhen.Models handled during my stay with Hitachi were 1.0" Microdrives, 1.8" drives (HummingBird), and 3.5" (Jupiter, Saturn, Pathfinder models) drives for Desktop.Major job descriptions:For 3.5" and 1.0" drives:> Tasks involved Yield monitoring and reporting during Development Phase to Design Maturity to Start of Normal Production giving on-time feedback for unexpected yield problems to respective correspondents. > Perform Yield FA to understand current and new detractors during new product launch and ensure that countermeasures are made and implemented in the next builds. > In charge of Rework Yield and Rework Disposition for failed drives maximizing scrap reduction by parametric optimization and by understanding major modes of fall-out by failure analysis > HDD level scrap cost reduction, and interface with different departments to implement necessary and quick actions to avoid further loss yield correctable detractors 1.8” Hummingbird (60G)> Assigned to lower HGA scrap cost by improving rework disposition and by qualifying the HGA Salvage operation in the quickest time possible while identifying the best candidates for this operation to achieve maximum recovered yield

> Prepare quality and comprehensive quotes for Printed Circuit Board ranging from single layer up to 24 layers. > Initiate releases and instructions for the production of customers' PCB and design the most appropriate and cost effective process flow to fabricate PCBs. > Initiate revision bumps for running products to improve yield and resolve issues occurring in the production