Promoted through ranks to Sr. Director of Engineering to provide strategic, technical and tactical leadership for IC Package Engineering Department within the Global Operations Organization. Manage an annual budget of >$2M, establish department goals to meet customer needs and align technology roadmap with project objectives. Lead and mentor a global team of 15-20 people focused on:✔ Mechanical robustness/reliability assessment from assembly to direct empirical testing via in-house lab operations. ✔ Mechanical modeling and simulation through finite element analysis (FEA) for cost-effective, proactive risk mitigation and rapid risk assessment of urgent quality issues. ✔ Support numerous customers in NA, APAC, and EMEA regions spanning applications from mobile, automotive, IoT, datacenter, and compute.✔ Electrical/Mechanical Interactions analysis to assess device level sensitivities caused by mechanical stress.✔ Established productive relationships with executives and key stakeholders and partnered cross-functionally with multiple teams✔ Key participant in M&A integration activities. Outlined tangible directives and goals for consultants and targeted company.✔ Streamlined data analysis and improved test techniques to include more technical depth and advanced analytics beyond basic data collection.✔ Developed predictive models/tests on critical products to correlate to key customer applications, yielding higher accuracy of predictions of end-user quality.✔ Revitalized and increase team productivity by re-organizing tasks, advocating for additional resources, prioritizing workload, and articulating clear expectations to internal stakeholders.

Joined the company as part of a one-year Engineering Rotation Program (ERP), advanced to Sr Engineer level, assuming progressively increased project management and team leadership responsibilities. Served as Lead Engineer on Development team consisting of engineers, technicians, and operators. Held purchasing authority and introduced cost reduction strategies. Managed workload prioritization, staff mentoring and weekly communications. Drafted summary reports and provided updates on behalf of the team.✔ Lead Process Development Engineer on power quad flat pack no lead (PQFN) package development. Transferred initial process and equipment to Tianjin, P.R.C. facility for factory integration. Pilot product won EDN’s Innovation of the Year.✔ Process Development engineer on RF module development; contributed to all aspects of assembly including substrate DFM, SMT, wirebond, encapsulation, and singulation.