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Mark Hendrix Email & Phone Number

Vice President of Engineering at viaPhoton, Inc. at viaPhoton
Location: Richardson, Texas, United States 11 work roles 2 schools
1 work email found @viaphoton.com 1 phone found area 972 LinkedIn matched
✓ Verified May 2026 4 data sources Profile completeness 100%

Contact Signals · 1 work email · 1 phone

Work email m****@viaphoton.com
Direct phone (972) ***-****
LinkedIn Profile matched
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Current company
Role
Vice President of Engineering at viaPhoton, Inc.
Location
Richardson, Texas, United States

Who is Mark Hendrix? Overview

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Quick answer

Mark Hendrix is listed as Vice President of Engineering at viaPhoton, Inc. at viaPhoton, based in Richardson, Texas, United States. AeroLeads shows a work email signal at viaphoton.com, phone signal with area code 972, and a matched LinkedIn profile for Mark Hendrix.

Mark Hendrix previously worked as Vice President of Engineering at Viaphoton and Head of Engineering, viaPhoton, Inc. at Viaphoton. Mark Hendrix holds B. S., Mechanical Engineering from Clemson University.

Company email context

Email format at viaPhoton

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{first}.{last}@viaphoton.com
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AeroLeads found 1 current-domain work email signal for Mark Hendrix. Compare company email patterns before reaching out.

Profile bio

About Mark Hendrix

Overview• Hard working professional with well-developed technical and management skills• Versatile and broadly experienced to provide both leadership and technical contributions• Articulate, persuasive, and energetic with strong project management skills• Developer of strategic plans and new products with focus on revenue realization• Architect of next generation optical, wireless, and power systems• Visionary for industry 4.0 automation and process developmentSkills - Product development• Demonstrated innovation and creativity – 20+ US patents granted, 10+ pending• Develop forward looking strategic plan for product technology roadmaps• Invent industry leading telecommunications infrastructure products• Implement best in class design CAD / DFM / FMEA practicesSkills - Business unit leadership• Product vision and strategic planning• Financial performance reporting• Talent acquisition• Production line startup and rampingSkills - Industry 4.0 automation• Development of industry leading micro-assembly machines• Direct integration of ML, computer vision, and machine code to manipulate small form factor robots• Lead application of HIL and MLops to realize complex process automation solutions • Creation of in-house web-based factory process tracking, data analysis, and KPI reporting systemsSkills - Product management• Customer interface and management• Requirements cascading to cross-functional teams• Revenue forecasting and margin analysis• Product lifecycle planning and execution

Listed skills include Direction Of Research And Development Staff, Creative Design Solutions, Wireless System Desigin, Modular Datacenter Design, and 45 others.

Current workplace

Mark Hendrix's current company

Company context helps verify the profile and gives searchers a useful next step.

viaPhoton
Viaphoton
Vice President of Engineering at viaPhoton, Inc.
AeroLeads page
11 roles · 44 years

Mark Hendrix work experience

A career timeline built from the work history available for this profile.

Vice President Of Engineering

Current

Aurora, Illinois, US

Nov 2022 - Present

Head Of Engineering, Viaphoton, Inc.

Current

Aurora, Illinois, US

Jan 2020 - Present

Principal And Owner

SRC is an engineering services company focused on product design and development for a range of clients. Services provided include: - Product development services from concept to production release - Mechanical engineering design using the Solidworks CAD system - Wireless telecommunications systems design - Project management of the product development.

May 2019 - Jan 2020

Executive Consultant

Telco Design Connect
Jun 2019 - Dec 2019

Director Of Engineering

Hickory, North Carolina, US

Direct team of engineers in the development of power, backup, cooling, and enclosures for wireless communications systems.

Jan 2017 - Apr 2019

Product Line Manager

Hickory, North Carolina, US

Architected and led development of pre-assembled tower-top wireless systems. Included design of RF distribution, fiber transmission, thermal, and structural aspects of cell site sub-systems.

Sep 2012 - Dec 2016

Senior Engineering Manager

Hickory, North Carolina, US

Oct 2005 - Aug 2012

Engineering Manager

Kista, Stockholm, SE

1999 - 2001 ~2 yrs

Engineering Manager

Fujitsu Network Communications
1992 - 1999 ~7 yrs
2 education records

Mark Hendrix education

B. S., Mechanical Engineering

Clemson University

M. S., Mechanical Engineering

Southern Methodist University
FAQ

Frequently asked questions about Mark Hendrix

Quick answers generated from the profile data available on this page.

What company does Mark Hendrix work for?

Mark Hendrix works for viaPhoton.

What is Mark Hendrix's role at viaPhoton?

Mark Hendrix is listed as Vice President of Engineering at viaPhoton, Inc. at viaPhoton.

What is Mark Hendrix's email address?

AeroLeads has found 1 work email signal at @viaphoton.com for Mark Hendrix at viaPhoton.

What is Mark Hendrix's phone number?

AeroLeads has found 1 phone signal(s) with area code 972 for Mark Hendrix at viaPhoton.

Where is Mark Hendrix based?

Mark Hendrix is based in Richardson, Texas, United States while working with viaPhoton.

What companies has Mark Hendrix worked for?

Mark Hendrix has worked for Viaphoton, Src-Design Solutions, Llc, Telco Design Connect, Commscope, and Xtera Communications.

How can I contact Mark Hendrix?

You can use AeroLeads to view verified contact signals for Mark Hendrix at viaPhoton, including work email, phone, and LinkedIn data when available.

What schools did Mark Hendrix attend?

Mark Hendrix holds B. S., Mechanical Engineering from Clemson University.

What skills is Mark Hendrix known for?

Mark Hendrix is listed with skills including Direction Of Research And Development Staff, Creative Design Solutions, Wireless System Desigin, Modular Datacenter Design, Fea Thermal And Structural Analysis, Pro/Engineer Cad Solid Modeling, Product Lifecycle Development And Management, and Product Management For Wireless And Optical Systems.

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