Mark Higginbottom Email & Phone Number

Sandy, UT, US

Product engineering excellence, specializing in test solution software and hardware development, New Product Project management processes and execution. Send me a private note to inquire on present booking availability.

Scottsdale, Arizona, US

Fairchild was acquired by ON Semiconductor in 2016. I was responsible for the acquisition integration and ramping the new product development of Low voltage, Medium Voltage, High voltage MOSFET's, GaN and SiC technologies. This is a combination of legacy Fairchild and ON product groups and the largest group by revenue, number of new product releases and.

Phoenix, Arizona, US

• Built and managed diverse teams of Engineering Managers, Product Engineers, Test Engineers and Project Managers, in six countries, to develop and ramp into production Power Discrete, Module and Power IC devices for the.
• Managed successful integration of key divisions into the ON structure, including integration and growth of engineering teams located in US, Korea, China, Philippines, Malaysia, and Vietnam. (Power MOSFET division >$1B.
• Seamlessly integrated all Power MOSFET and Silicon Carbide (SiC) products into ON infrastructure while simultaneously releasing several key new technologies with hundreds of products on time and on budget while.
• Designed scalable product development and business practices which resulted in release of multiple new technologies including Power MOSFET, IGBT, SiC and Rectifiers in both discrete and module platforms. Deliverable.
• Developed and implemented power production test development and characterization strategies enabling consistent and accurate data sheets enabling customers to understand our products and accurately compare to.
• Managed multiple package developments including installing new production lines and driving equipment acquisition processes. Developed fast prototyping processes.

Dallas, TX, US

• Managed product engineering integration of Burr-Brown and Chipcon acquisitions, transitioning older legacy processes and methodologies into scalable strategies and flexible engineering teams, enabling volume growth of.
• Responsible for releasing over 500 test solutions, both new and legacy conversions, covering several thousands of devices. Enabled PA/HPL product lines to go from less than 5% to over 80% of total product volume onto.
• Directly responsible for over $100 million in cost reductions in last three years alone.
• Manage multiple offloads of Fab processes, assembly and test site moves. Projects recognized to have met all internal goals for schedule and continuity of supply.
• Sample product lines; Op-Amps, Instrumentation Amplifiers, Buffers, ADC, DAC, Audio Amps, Temp Sensors...

Dallas, TX, US

Dallas, TX, US

• Managed PE integration of Unitrode and Benchmarq acquisition including assembly offloads to internal factories and Merrimac Fab shutdown and movement of product lines, technologies and probe solutions to Sherman Texas..
• Championed and drove acceptance of new analog test platform at TI, Managing several test platform shootouts to determine best analog strategy for TI. This included developing first multisite Eagle solutions, setting.

Austin, Texas, US

• Responsible for multiple custom power integrated circuit new product developments, ramp-ups and production runs for the automotive market, utilizing both domestic and international fabrication, assembly and test sites.
• Led and was a key contributor to teams which qualified and implemented several generations of power analog BICMOS, CMOS technologies including Fab transfers, characterizations, reliability and capability analysis.
• Led and was a key contributor to teams which managed several assembly technology implementations and developments including several custom package and flip chip manufacturing line start-ups including reliability.
• Led development team which replaced Au wire with Cu wire for automotive power IC products for significant cost savings.