Developing of system concepts for the next ADAS (advanced-driver-assistance-systems) generation up to SAE level 4 in close cooperation with customers, product management and software architects. Definition of sensor setups, SoC (system on chip) evaluation and architecture definitions. (HPC / Zones architecture, X-domain HPC).

Managing a feasibility study of a SAE L3 system, by challenging space constrains ( ECU size) awarded by Cariad (VW Group). Definition of the ECU and sensor setup (SoC, Ethernet/ PCIe switch, sensor interfaces: cameras, radars, ultrasonic) according to customer requirements. Leading a hardware (electrical engineering) project team in Iasi, Rumania.

Prepare System architectures of ECUs (electrical control unit) and sensor setups according to customer requirements in close cooperation. Preparing of BOMs (bill of material) for calculation of hardware and mechanic costs together with the procurement department. Estimation of development and production costs in alignment with production. Performing technical presentations at customers. Success: Award Surround view system VW group, Trailer-assistant-system Fiat-Chrysler, Park system Audi/Cariad, NCAP-System Audi/Cariad

Selection of a suitable graphic processor to fulfill the chip size requirements of 13x13mm and the required processing performance to realize object detection and classification functions in an single camera head ( SVS ). Supporting the supplier certification process and sourcing. Preparing Quotes (technical concept, BOM) for OEMs and held technical presentations at customers in acquisition phase.Succeed: Award of Mercedes and VW Group

Inovation projects:• Integration of a „bare die“ camera sensor ( imager) into a camera module by using wire bonding. Target to save the cost of the imager housing and improve the optical path/image quality. • Camera based rain and light sensor for cars. Detection of rain for automatic wipers and darkness for automatic headlight control. CPM (Customer project manager) for a test car proof of concept project with Peugeot.

Supporting mass production: Cost reduction, qualifying new suppliers, ensure parts availability, auditing new suppliers, introduction of second source modules in mass production (PCN, ECN process). Subproject manager camera module integration.Products Nokia Asha 303, Asha 311.

Subproject manager for module integration camera and touch panel in close collaboration with manufacturing partners, suppliers and module specialists. (Asia, UK, Denmark, Finland). Schematic design, PCB review, signal bus qualification (MIPI), image quality tuning, supporting tester and line design for introducing into mass production.

Integration of camera modules and graphics processors / ISP for jpeg compression in mobile phones. Products: Nokia 7370, 6131, 6300

Integration of camera modules into several mobile phones, from CIF up to 1.3MP resolution. Setting up a camera measurement and test system for optical qualification of camera modules with test patterns using LabWindows. Development of an 5x5 mm camera module for video calls. Products: Siemens MC60, CX65, M65, CX75, M75

Prepared first display specifications in close contact with suppliers. Integration of displays in mobile phones: Schematic design, PCB review, electrical and optical qualification, programming of display-drivers for testing in LabWindows.Products: Siemens C45, C55.

Design of interfaces and controllers used in telecommunication, especially for ISDN according to customer specification (Siemens Networks). Design of test systems to verify airbag-controllers for automotive.

Hardware and software development of embedded controllers for pneumatic delivery systems in hospitals based on Intel 8051 microcontroller derivate with CAN communication.