Installation and configuration of server racks in a datacenter environment for R&D testing on Broadcom/LSI storage controllers:Qualify each server configuration by running in-house automation tools to provide a configuration baseline.Inventory management of servers, drives and accessories.

Built test systems in BS Tech chassis for R&D testing and offshore manufacturing of Seagate NVMe SSDs: Control units: host computer, DCPMs, and on-board wiring. Wiring: assembled and labeled harnesses for power, HD, and clock signals. Qualified each test chamber by running standard baseline programs.Managed the RDT Lab by responding to the need for troubleshooting/repairing components, installing or removing memories, and reconfiguring test chambers.

Followed detailed procedures to build and program accelerated data storage cards that were distributed to customers.Assembled SSD storage cards, programmed firmware into them, and validated their functionality to satisfy the need for customer samples and fill customer orders.Documented in writing the steps used to assemble, program firmware, and test the functionality of SSD data storage cards.Installed, configured, and used Windows Server operating systems, CentOS and other Linux operating systems on servers to support testing.Administered a group of servers that were accessed remotely to perform critical hardware and software testing.Created and edited UNIX shell scripts to automate repetitive programming tasks.Point of contact for the successful completion of the annual equipment calibration program.Troubleshot non-functional SAS and SATA storage hardware to fix problems.

Utilized a function generator and oscilloscope to characterize F-RAM memories as part of joint development project to standardize non-volatile memory manufacturing.Contributor to a multi location team that developed advanced performance properties for the CMOS product and achieved publication in the IEEE Journal.Key member of special project team that qualified and shepherded a custom product to successfully ship by 3rd quarter close. Characterized five new and two legacy F-RAM memories by parametric testing using Automated Test Equipment, analyzed the data using Excel, and wrote detailed, comprehensive reports which enabled mass production.Sustaining Engineer for eight F-RAM memories: monitored yields, generated customer samples, and determined production test flows.Worked with the Test Engineering and Design groups to investigate out-of-spec operating parameters and find process changes to correct the failures.Analyzed test data using Excel to determine the CPKs of operational parameters to evaluate the device performance in contrast to the required operating specifications.Analyzed customer product failures to identified out of spec operation and enable the customer to operate in spec and prevent further failures.Assisted in the failure analysis of customer returned parts by bench testing to verify the failure and gather data in order to write detailed, comprehensive reports for the FA Engineer.Performed calibrations and operated Electroglas wafer probers for data collection.Wrote the Electroglas EG4090 Prober Engineering Setup and Operation procedure.Wrote the Incoming/Outgoing Wafer Inspection procedure for wafers produced by Ramtron's foundry.

Assisted the Engineering staff with experiments that continually improved the quality of the products.Troubleshot technical problems with the manufacturing process to keep the manufacturing line going.Optically inspected nonconforming wafers to determine the out of control process and disposition the wafers.Worked inside the FAB providing technical support for the ASML steppers by giving directions to the operators.

Responsible for the daily operations of Photolithography in the FAB: performed daily checks and qualifications on equipment in the department, gathered SPC data to ensure the tools were operating within specifications, and responded to out of spec conditions.Programmed jobs, operated the tools, and collected SPC data for the Canon 1550 MkII (G-line) stepper / DNS track combination and the Nikon 2205i11D (I-line) stepper / TEL Clean Track combination.Operated a Hitachi 6100 CD Scanning Electron Microscope, and a JEOL 6401F SEM combined with a LWMS (metrology) system to check photo-mask overlay accuracy.Certified the calibration of the LWMS metrology system using a NIST standard.Programmed jobs for and operated tools supporting Photolithography including a KLA5100 metrology system, two Fusion Deep UV resist curing systems.Cross-trained in other departments for redundancy to ensure uninterrupted wafer production; deposition, etch, and post-etch clean.Communicated progress and issues to the engineering and maintenance staff by writing detailed daily pass downs.