Responsibilities- Design and develop complex communication systems, in the frequency band of UHF SATCOM, VHF, HF and GPS.- Manage and conduct of Engineering Change Proposals within Defence Acquisition/Sustainment systems engineering environment

Providing engineering support to a wide range of SATCOM and space projects and taskings within Defence

Responsibilities:- Establish uplink and downlink services with satellites servicing Asia-pacific region;- Test and troubleshoot satellite communication link;- Monitor satellite uplink and downlink condition, and coordinate with Satellite Engineer for emergency repairs;- Configure and monitor station antennas, including Antenna pointing and tracking;- Conduct preventive and corrective maintenance for Antennas, modems, RF and network equipment.

Responsibilities:- Act as Project Proxy and lead projects in the Asia Pacific region- Organise regular meeting with project team for progress presentation and discussion- Develop quality and reliability test according to product specifications- Maintain project schedule and review risk management report regularly- Liaise with quality department and Asian printed circuit board suppliers for project coordination- Provide CAD and simulation support to the departmentAchievements:- Developed and manufactured test samples with two major Asian Printed Circuit Board suppliers- Achieved technology feasibility approval for project with a forecast volume of 1.1 million orders- Developed end-of-life simulation and reviewed technology specification of High Density Interconnect technology using CAD simulation

Responsibilities:- Review manufacturing processes and suppliers management- Liaise and visit printed circuit board suppliers for technology and capability survey- Review manufacturing process specifications by collecting and analysing data from manufacturing plant- Provide CAD and simulation support to the departmentAchievements:- Created Department Roadmap derived from Supplier Technology And Capability Survey - Electronic Control Unit Housing Embossing Specification change was approved and scrap rate was reduced- Defined technology specification according to the failure model of Solder Ball Joint on Printed Circuit Board analysis using CAD simulation- Improved product tolerance according to the results of Supplier Tolerance Chain Study

Responsibilities:- Perform experiments to investigate the behaviour of liquid droplet on super-hydrophobic surface- Analyse, conclude and present findings to faculty boardAchievements:- Final Year Project thesis “Liquid-body resonance while contacting a rotating super-hydrophobic surface” published in The European Physical Journal