Matthew Kueper Email & Phone Number

Redmond, Washington, Us

- Participates in architectural discussions and evaluate power, thermal and cooling solutions required to meet the demands of AI/ML workloads - Analyzes power, thermal and cooling solutions and develop validation and integration plans - Analyzes new interfaces and subsystems to develop integration plans, analyze power efficiency, debug integration issues, and provide recommendations. - Defines system behavior and concept of operations for the platform to ensure compatibility with Microsoft Azure datacenter software, serviceability, telemetry, and customer expectations. - Performs NUDD (new, unique, different and difficult) technology and feature analysis and provide risk assessment and mitigations. - Drive stechnical requirements and ensure the solution is flexible and scalable across the full (HW/FW/SW) stack. - Enables platform and solution level discussions, influencing architecture of the product, and delivering to product goals across quality, reliability, and performance. - Collaborates with internal, external, and open-source partners to onboard innovative technologies in a seamless manner.

Seattle, Washington, Us

- Project management focal point for system design, implementation, integration, and verification/validation (V&V) of hardware and associated firmware for devices in Mason’s new product development portfolio.- Participates in project planning, process updates, and design reviews for experimental device designs including creation and ownership of engineering requirements and architecture documents.- Spearheaded successful evaluation, selection, and implementation of new requirements management tool for documenting requirements traceability and test coverage. - Manages supplier and ODM relationships to provide technical oversight including guidance on design evolution and adherence to device specifications and compliance with relevant standards.

Redmond, Washington, Us

- Responsible for test and validation of mechanical/electrical hardware design, as well as software/firmware thermal, power, and performance architecture.- Led process architecture and executed on development for internal toolset to improve lab data collection, processing, and presentation. - Automated lab test flows to push collected system data into Azure blob and database storage resources and integrated Python and R based test reports and dashboards. Resulted in reductions in test inefficiency and increased testing scalability/data integrity.

Redmond, Washington, Us

- Principal mechanical engineering resource, reporting directly to company CTO, for all aspects of product design and R&D lifecycle including architecture, packaging, fabrication, sourcing, andsupplier management.- Developed wearable and small form-factor consumer electronic devices for fitness and healthcare applications.

Kirkland, Washington, Us

- Led 3 person mechanical team, managing test execution and providing adhoc test tool design support, for “Microsoft Band” and “Xbox accessories” hardware validation groups.- Created hardware test solutions based on engineering requirements, using various disciplines such as, robotics, pneumatics, servos, and mechanical fixtures.

Rochester, Minnesota, Us

- Performed mechanical design for supercomputing and biomedical applications in the Special Purpose Processor Development Group.- Supported end-to-end design and build of prototypes by applying thermal modeling and mechanical fabrication techniques (including CNC, sheet-metal, and rapid prototyping) to amultidisciplinary approach to solutions for unique client requirements within a small team of engineers.- Led mechanical/packaging design for a biomedical monitoring device used in the Mayo Clinic’s 2012 Mount Everest expedition to study effects of high altitude on the body

Armonk, New York, Ny, Us

- Managed thermal design and verification test responsibilities through project lifecycle for over six IBM Power and Storage systems product releases, including the Power 750 system used in IBM’s Watson supercomputer.- Advised on mechanical design layouts for fan, high power module, and heat sink placement based on detailed airflow and heat transfer CFD modeling.- Communicated & interacted with vendors to select the appropriate thermal components to meet performance targets, maintain reliability standards, and minimize costs.- Collaborated with diverse technology teams—such as packaging, interconnect, power, memory, firmware, micro-electronics, EMC, acoustics, vibration, industrial design,manufacturing, procurement, and quality—to achieve optimal system design.

Armonk, New York, Ny, Us

- Improved laboratory testing capabilities through automation and modification of instrumentation using LabVIEW system design software.- Executed airflow and thermal testing to evaluate performance of a variety of system components including heat sinks, fans, and thermal interface materials.

Bachelor Of Science - Bs, Computer Science

Bachelor Of Science - Bs, Mechanical Engineering