Maurizio Lenzi Email and Phone Number
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I’m a professional with 25+ years of experience in a broad range of functions in the Telecom & Semiconductor area (R&D, Sales & Marketing, Operations), who is currently leading the Back End Operations team (lead frames) of the Automotive Product group of ST Microelectonics.Key activities of the Back End Operations team is to define and execute the packaging roadmap for the Automotive products and to lead the design and the industrialization of new products to meet the customers needs assuring the best cost and quality.In this role I support marketing, introducing the packaging roadmap to customers. I also work with Suppliers, Q&R, Program managers and customers during all the life cycle of the product from design in to qualification and ramp-up in production.I’m also responsible for the supply chain (packaging related) definition and I select the suppliers for our products. I’m also doing regular technical audit in supplier’s plats to ensure that they are working according to ST standard and their roadmaps are aligned with divisions needs.I’m driving also key R&D programs on advanced packaging solutions.My credentials are attained through rigorous education, continuous training and wide experience.
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Manager Of Back End (Packaging) Npi And Innovation For Asa And Ips Bu Of Analog SubgroupStmicroelectronicsNovara, It -
Manager Be Operations For Automotive Product GroupSt Microelectronics Oct 2017 - PresentAgrate Brianza
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Manager Of Advanced Back End Technology TeamSt Microelectronics Mar 2002 - Sep 2017Agrate BrianzaI was managing the Advanced Back End Team, part of the Operation function of the Digital ASICs Product division (whose revenue are in the range of $200M/year). In that role I was responsible of a team of 4 senior Back End engineers and I managed several R&D and Industrialization programs coordinating remote teams (mainly in Asia) and supporting customers in US and Europe.Main achievements:- More than 20 ASICs successfully bring to production and more than 10 ASICs migrated from Lead based metallurgies (SnPb) to lead free- Qualified the most aggressive package done by ST, FCBGA Thermal enhanced with 50x50mm body size with 400 sqmm die- Lead Chip To Package interaction (FE/BE) qualification for CMOS 32 & 28 nm Technology node - Start up of several R&D programs in the 2.5D & 3D packagingPrevious to be assigned to this position I was responsible of the design of silicon photonic products in the R&D organization of ST.Main achievements: - Filed of 4 international patents - Several papers published
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Product Line ManagerPirelli Optical Technologies Mar 2000 - Mar 2002Milan Area, ItalyProgram Line Manager 10Gbit/s Lithium Niobate modulator product family under the Sales & Marketing organization, reporting to the Marketing Director.In this position I was responsible to support Sales and Marketing initiative to promote Pirelli 10 Gbit/s modulators to telecom OEM, managing technical relationships with customers from the introduction of the product, to the design in and the support during the entire life of the product.Main achievements: Enlargement of the customers from 1 to more than 10 Several design in won in tier1 customers (Cisco, Alcatel, Marconi,..) -
Optical DesignerItaltel 1991 - 1999Photonic integrated IC designer team manager, inside the photonic team of the Central R&D of Italatel.In this position I worked as design manager coordinating a team of 3 engineers. The team was engaged in several integrated photonic ICs as for example: optical variable attenuators, Mach-Zehnder based WDM filters, Arrayed Waveguide dense WDM filters. The team was also responsible for characterization of the products.I was also involved in several European R&D projectsMain achievements: Filed of 4 international patents Several papers publishedPrior to become team manager I was working as designer in the same team
Maurizio Lenzi Skills
Maurizio Lenzi Education Details
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Ingegneria Elettronica -
Istituto Agrario G. Bonfantini -
Scuola Media
Frequently Asked Questions about Maurizio Lenzi
What company does Maurizio Lenzi work for?
Maurizio Lenzi works for Stmicroelectronics
What is Maurizio Lenzi's role at the current company?
Maurizio Lenzi's current role is Manager of Back End (packaging) NPI and Innovation for ASA and IPS BU of Analog Subgroup.
What is Maurizio Lenzi's email address?
Maurizio Lenzi's email address is maurizio.lenzi@st.com
What is Maurizio Lenzi's direct phone number?
Maurizio Lenzi's direct phone number is (512) 434*****
What schools did Maurizio Lenzi attend?
Maurizio Lenzi attended Politecnico Di Torino, Istituto Agrario G. Bonfantini, Scuola Media.
What are some of Maurizio Lenzi's interests?
Maurizio Lenzi has interest in Social Services, I Love Printed Books, Science And Technology, Human Rights, Animal Welfare, Arts And Culture, Health.
What skills is Maurizio Lenzi known for?
Maurizio Lenzi has skills like Product Marketing, Studio Lighting, Fiber Optics, Silicon Photonics, Cross Functional Team, Bicmos, Photonics, Digital Photography, Studio Photography, Laser, Sensors, Analog.
Who are Maurizio Lenzi's colleagues?
Maurizio Lenzi's colleagues are Claire Monteil, Louise T., Antoine Gubert, Jagjeet Singh, Cristian Pascaru, Bruno Famiani, Li Lian Tay.
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Maurizio LENZI
Bologna
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