資深部門經理
Current1.Develop AI Defect Detection System 2.Interested in CIM system development.3.Lead, design, and develop software system of automation.
Mar 2020 - Present
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Max Hsiao Email & Phone Number
資深部門經理
at
頎邦科技 CHIPBOND
1 work email found
@chipbond.com.tw
LinkedIn matched
✓ Verified Jun 2026
4 data sources
Profile completeness 100%
Current company
Role
資深部門經理
Location
Taoyuan City, Taoyuan City, Taiwan, Province Of China
Who is Max Hsiao? Overview
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Quick answer
Max Hsiao is listed as 資深部門經理 at 頎邦科技 CHIPBOND, based in Taoyuan City, Taoyuan City, Taiwan, Province Of China. AeroLeads shows a work email signal at chipbond.com.tw and a matched LinkedIn profile for Max Hsiao.
Max Hsiao previously worked as Program Manager at 頎邦科技 Chipbond and Manager at Manz Automation Ag. Max Hsiao holds Bachelor'S Degree, Electrical And Electronics Engineering, A from National Kaohsiung University Of Applied Sciences.
Company email context
Email format at 頎邦科技 CHIPBOND
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{first}{last}@chipbond.com.tw
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Profile bio
About Max Hsiao
1. 7+ years of experience building and leading CIM/MES development teams that design and deliver highly reliable and scalable systems.2. 10+ years of experience developing highly available and reliable CIM(TCS/BC/EAP) System3. Able to design and implement well-crafted, scalable, and maintainable code (.Net)4. Architect CIM software structure to meet customer's MES.5. Defines the common communication specification between Block Controller and process equipment for customer6. Experience with .NET (C#, VB.NET) and MSSQL, MYSQL , PLC Ladder Language(IEC 61131-3)7. Experience with Mitsubishi, Keyence PLC, OMRON PLC, CodeSys(8. Experience with Fieldbus, FL/Net , Ethernet ,NET/H , NET/G, CC-Link, Profibus, Interbus.
Listed skills include Vb.Net, Plc Programming, Codesys, Java, and 8 others.
Current workplace
Max Hsiao's current company
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4 roles
Max Hsiao work experience
A career timeline built from the work history available for this profile.
Program Manager
1.Line Control CIM System (BCS/EAP/TCS/CIMPC) Application Development.2.Prepared an estimate for all modules required for automation.3.Monitored work of multiple automation projects at a given time
Jun 2018 - Mar 2020
Manager
1. Manage CIM development team of engineers and managers into a highly performing engineering organization.2. Develop and execute on both the CIM software roadmap and technical strategy for all assigned areas of responsibility.3. Provide direct supervision and leadership to a team of.Net developers.4. Research, learn, evaluate and make technology.
May 2011 - May 2018
Senior Engineer
Responsibilities:1.Developing BC(Block Control) system using PLC.2.Implement CIM(Computer integrated manufacturing) program with HSMS(SECSII) for MCS (Material Control System)3.Making CIM specification 4.Helping in debugging and bug fixing from others department in company.5.PLC programming for automatic conveyor/Robot/LD/ULD system for CF/Cell factory.
Jul 2005 - May 2011
1 education record
Max Hsiao education
FAQ
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Quick answers generated from the profile data available on this page.
What company does Max Hsiao work for?
Max Hsiao works for 頎邦科技 CHIPBOND.
What is Max Hsiao's role at 頎邦科技 CHIPBOND?
Max Hsiao is listed as 資深部門經理 at 頎邦科技 CHIPBOND.
What is Max Hsiao's email address?
AeroLeads has found 1 work email signal at @chipbond.com.tw for Max Hsiao at 頎邦科技 CHIPBOND.
Where is Max Hsiao based?
Max Hsiao is based in Taoyuan City, Taoyuan City, Taiwan, Province Of China while working with 頎邦科技 CHIPBOND.
What companies has Max Hsiao worked for?
Max Hsiao has worked for 頎邦科技 Chipbond, Manz Automation Ag, and Auo.
How can I contact Max Hsiao?
You can use AeroLeads to view verified contact signals for Max Hsiao at 頎邦科技 CHIPBOND, including work email, phone, and LinkedIn data when available.
What schools did Max Hsiao attend?
Max Hsiao holds Bachelor'S Degree, Electrical And Electronics Engineering, A from National Kaohsiung University Of Applied Sciences.
What skills is Max Hsiao known for?
Max Hsiao is listed with skills including Vb.Net, Plc Programming, Codesys, Java, Microsoft Office, Hmi Programming, C++, and Mitsubishi Plc.
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