LB Lusem have developed its own process for thin wafer(Back Side: BGBM, Front side: electro-less plating), and began mass production from 2020.Our major customers are manufacturer of power discrete(MOSFET / IGBT), and we provide wafer post processing service to our customers.We could provide better quality & more net die compared to conventional TAIKO type by our own full grind type.From Front Side Metal, Back side BGBM, Sawing, Probe Test, tape/reel packing, we are only Korean company who could provide 1-stop turnkey solution. More needs of WLCSP PKG is expected since thin wafer is trend in industry (MP 80um~60um, Lusem: under 30um) even though plastic molding packages are used most for now.In particular, WLCSP PKG MOSFET is applied to Protection Circuit of Battery Pack for Smartphone (Samsung/Apple/Oppo & etc.)Thinner/Smaller/Lighter(Thinner Si / Thicker Copper) would be a future trend for the product, so we expect more need for this.Please contact us if you want more info regarding our process.