Maxime Bouvat-Merlin Email & Phone Number

Santa Barbara, CA, US

Santa Barbara, CA, US

Responsible for the full Product roadmap (HW, SW and Services).Leading the Product organization (HW, SW, Product Management, Audio, Design and Operations).

Santa Barbara, CA, US

Responsible for defining, developing and delivering the HW Products.Leading the HW Products Development organization (that includes Industrial Design, Engineering (HW and SW) and Product Management), the Advanced Development team and the Operations team (that includes manufacturing, supply chain, business forecast, fulfillment, logistics and quality)..

Santa Barbara, CA, US

Responsible for defining the Sonos HW products and technology roadmaps and for driving its execution.The HW organization includes Product Management, Technical Program Management, Industrial Design and various engineering functions like electrical engineering, mechanical engineering, radio, acoustic, DSP/algo for audio/voice/smart features, advanced.

San Jose, California, US

• Responsible for worldwide engineering department (reporting to CEO), delivering best-in-class sensors computing sub-systems for smartphone, wearable and for IoT applications.
• Engineering department included platform architecture, low power chip design and verification/validation, product engineering, algorithms development, FW/SW integration (Android and RTOS), system test, reference.
• Essential member of the leadership team setting the company’s strategy, including roadmap, customer engagement strategy, mid term diversification strategy, partnership engagements, and corporate development.
• Developed multi cores SoCs, integrating complex featureset at dramatically low active and sleep power.
• Delivered optimized algorithms focusing on activity tracking, gestures, health monitoring, always-on voice detection/commands.

San Diego, CA, US

• Responsible for delivering Qualcomm Connectivity Roadmap to support various product lines (Mobile/Computing Clients, Access Points, Automotive,...).
• Part of Senior Management team responsible for strategy, portfolio alignment/prioritization across business units and for program milestones approval.
• Responsible for delivering the Wi-Fi technology roadmap, intended to bring leadership features to the various product lines (consumer, mobile, access point, …).
• Brought up next key technologies from concept to actual Plan Of Record programs.
• Led the execution of key priority 1 programs with hands on resolution of technical issues.
• Partnered with SVP of Engineering to improve efficiency (FW development process, validation strategy, platform bring up, …) and revisited geo strategy for optimized resource management (derivative products,…).

Palo Alto, California, US

• Head of the Technical Program Management Office within Mobile Application Processor Business Unit, reporting to VP of Engineering.
• Led a team of program/project managers globally dispersed in charge of executing on ~ 10 chipset programs (ASIC, HW, SW and test) targeting smartphones, tablets and Enterprise phones. Indirectly leading programs of.
• Responsible for the definition and execution of key chipsets including Baseband, RF, Power IC, SW and HW platform development.
• Hands on participation on critical programs, coaching/mentoring the various program managers/program teams to ensure flawless execution.
• Established and improved the Product Development Process (PDP) from business opportunity to end of life in order to drive the Business Unit to maximum efficiency (light weight process) and predictability.
• Supported VP of Engineering to structure the newly formed engineering organization. Defined and implemented methodology for System Engineering, SW Integration/Release and System Test activities.

Palo Alto, California, US

• Led an organization of 3 team managers and ~60 engineers (US and Korea) in the areas of applications engineering/customers support, functional chip validation and SW drivers development on multiple operating systems.
• Reported directly to Business Unit General Manager. Managed all administrative aspects including hiring, performance management, individual development and compensation alignment.
• Involved in roadmap definition, strategic direction of the business unit and alignment with other business units.
• Defined and implemented a product development process for the entire Business Unit.
• Improved the ramp up to production flow, working with the Operations team.

Dallas, TX, US

• Led an organization of four team managers and ~50 engineers in charge of delivering 3G HW platforms.
• Managed all administrative aspects including hiring, performance management, individual development and compensation alignment.
• Led the HW platforms definition, development and validation steps and ensured on time/on budget delivery of the validated boards.
• Defined and led 3G subsystem silicon validation activities across USA, France and Japan ensuring functionality and performance of the TI 3G chipset, in a multi-site environment.
• Managed a cross organizational 3G RF Subsystem program (which included TI DRP technology) based on customers requirements and company’s business and marketing strategy.

Dallas, TX, US

• Responsible for RTL/GATE level verification and silicon validation of TI OMAP (ARM and DSP cores) family and 2G/3G SoC families. Developed low level drivers/BSP in C and assembly languages.
• Led a worldwide team (France, India, US and Japan) of up 100 internal and external engineers and project managers across several projects. Accountable for all aspects of line management including recruitment, staff.
• Set strategy for the team to ensure efficiency and cost reduction. Selected low cost external resources in India and Eastern Europe in order to reduce R&D cost and optimize operations.
• Led the HW Platform and Support organization comprising of 15 engineers on site and 15 off site contractors. Managed all administrative aspects including hiring, performance management, individual development and.
• Led the WW board/PCB development process alignment across multiple TI sites in the USA, Denmark and France.