Max Sidorov Email & Phone Number

San Jose, Ca

Materials Characterization Lab Supervise and operate analytical TEM/FIB lab in support of materials and process development of flash memory and other semiconductor devices.  TEM Techniques: TEM, HRTEM, STEM, EFTEM, EELS, EDX.  FIB TEM sample preparation. Instruments: FEI Tecnai F30, FEI Strata 400 and Expida 1255 Dual Beam, Omniprobe.

Sunnyvale, Ca

Technology Development Group Operated analytical TEM/FIB in support of materials and process development of microprocessors and flash memory.  TEM Techniques: TEM, HRTEM, STEM, EFTEM, EELS, EDX, holography and tomography.  FIB TEM sample preparation: ex-situ liftout, in-situ liftout (Omniprobe), pre-thin, low-K polishing, low-angle low-voltage ion milling for post-FIB cleaning. Instruments: Philips Tecnai F30, FEI Strata 235 and Altura 835 Dual Beam, Omniprobe, Gentle Mill.

Eindhoven Area, Netherlands

Applications Lab @ Philips Electron Optics / FEI in Eindhoven, the Netherlands Responsible for Materials Science and IC type of TEM and STEM research. Research and Development for the new generation of Philips microscopes (Tecnai). Advanced TEM and STEM applications and techniques: ultra HR-TEM, HR-STEM, EDX, GIF, EF-TEM, FEG TEM, electron holography, high spatial resolution analysis, remote microscopy, single beam FIB (FEI 200). High-end demonstrations. Teaching:… Show more Applications Lab @ Philips Electron Optics / FEI in Eindhoven, the Netherlands Responsible for Materials Science and IC type of TEM and STEM research. Research and Development for the new generation of Philips microscopes (Tecnai). Advanced TEM and STEM applications and techniques: ultra HR-TEM, HR-STEM, EDX, GIF, EF-TEM, FEG TEM, electron holography, high spatial resolution analysis, remote microscopy, single beam FIB (FEI 200). High-end demonstrations. Teaching: Theory and practice of TEM and associated techniques. Customer training and support. Sales support. Show less

Tempe, Az

Center for High Resolution Electron Microscopy Analytical Electron Microscopy of advanced materials and devices. Conventional and High Resolution Electron Microscopy Characterization of Silicon-Based Nanostructures and other Advanced Materials. In-situ TEM. Implementation of Hollow-Cone Imaging technique for Ultra-High Resolution. Computer HRTEM image simulation and digital image processing/acquisition. Advanced methods of TEM sample preparation.

Tempe, Az

Center for Solid State Science Characterization and fabrication of novel intercalation materials. Conventional and High Resolution TEM. Dynamic and in-situ TEM. Low Temperature and Cryo TEM. TEM of air-sensitive and metastable materials. TEM sample preparation (including cryo). Quantitative HRTEM  Computer HRTEM image simulation and digital image processing/acquisition.

Moscow, Russian Federation

Technology Group:Growth and characterization of epitaxial thin films and bulk materials.Automation of processesElectron Microscopy Group:Analytical TEM and STEM.High Tc superconductor films and ceramics, semiconductor thin films, super-lattices and quantum wells. Radiation defects in semiconductors..

Ph.D., Science And Engineering Of Materials

Ph.D. Thesis: "Structure and Dynamics of Mercury-Intercalated Titanium Disulfide".

Ms, Electrical Engineering

now it's called "National University of Science and Technology"  Department of Semiconductor Materials and Devices.  M.S. Thesis.