A seasoned semiconductor professional with over 10+ years of experience including 5+ years in the industry working on leading-edge transistor technology: FinFet and GAA R&D at Intel as a FEOL/MOL process integration engineer and cross-functional team leader focusing on yield improvement, performance and reliability enhancement, and ramping a technology node from R&D to HVM.· Extensive experience in process development and HVM in a fast-paced environment· Worked with large amount of data and engineers from various teams to identify, build models for, andresolve yield, performance, and reliability problems· Won Intel divisional awards for delivering new processes for improving DLY and PLYSome examples of my work: ·         Received Intel divisional awards for over 15X defect reduction and elimination of a systematic defect for Intel’s first Contact Over Active Gate (COAG) architecture·         Used 𝗺𝗼𝗱𝗲𝗹-𝗯𝗮𝘀𝗲𝗱 𝗽𝗿𝗼𝗯𝗹𝗲𝗺 𝘀𝗼𝗹𝘃𝗶𝗻𝗴 and developed novel process flows to reduce data lead time for model validations and solution implementations·         Based on 𝗿𝗼𝗼𝘁 𝗰𝗮𝘂𝘀𝗲 𝗮𝗻𝗮𝗹𝘆𝘀𝗶𝘀 (𝗥𝗖𝗔) to execute short-term fixes to allow continuous learning and qualify long-term process changes to address the underlying problems·         Led 𝗻𝗲𝘄 𝗽𝗿𝗼𝗱𝘂𝗰𝘁 𝗶𝗻𝘁𝗿𝗼𝗱𝘂𝗰𝘁𝗶𝗼𝗻 (𝗡𝗣𝗜) through the responsible segments and made prompt changes based on incoming design and process changes and outgoing requirementsBeing able to learn and solve new problems with great teams is what I like about my job!Additionally, I enjoy sports, let it be playing a pick-up basketball game at a local park, joining an organized baseball practice with a group of friends, or attending a soccer game, I love them all!   I enjoy meeting people, give me a shout at maigo.liu@gmail.com or just message me on LinkedIn.