AeroLeads people directory · profile

Mandar Shinde Email & Phone Number

PhD (Mechanical Engineering) | Product Design Engineer| FEA Analyst | Stress Analysis | Material characterization | Additive Manufacturing at Intel Corporation
Location: Chandler, Arizona, United States 6 work roles 3 schools
1 work email found @tatamotors.com LinkedIn matched
✓ Verified May 2026 4 data sources Profile completeness 100%

Contact Signals · 1 work email

Work email m****@tatamotors.com
LinkedIn Profile matched
3 free lookups remaining · No credit card
Current company
Role
PhD (Mechanical Engineering) | Product Design Engineer| FEA Analyst | Stress Analysis | Material characterization | Additive Manufacturing
Location
Chandler, Arizona, United States
Company size

Who is Mandar Shinde? Overview

A concise factual answer block for searchers comparing this professional profile.

Quick answer

Mandar Shinde is listed as PhD (Mechanical Engineering) | Product Design Engineer| FEA Analyst | Stress Analysis | Material characterization | Additive Manufacturing at Intel Corporation, a company with 10 employees, based in Chandler, Arizona, United States. AeroLeads shows a work email signal at tatamotors.com and a matched LinkedIn profile for Mandar Shinde.

Mandar Shinde previously worked as Packaging Engineer at Intel Corporation and Graduate Research Assistant at Arizona State University. Mandar Shinde holds Doctor Of Philosophy - Phd, Mechanical Engineering from Arizona State University.

Company email context

Email format at Intel Corporation

This section adds company-level context without repeating Mandar Shinde's masked contact details.

{first}.{last}@tatamotors.com
86% confidence

AeroLeads found 1 current-domain work email signal for Mandar Shinde. Compare company email patterns before reaching out.

Profile bio

About Mandar Shinde

Experience in developing electronic packages & systems with scope in mechanical design (CAD), simulations (FEA) and characterization (Lab), assembly manufacturing processes, and enabling external suppliers.• Experience in developing LGA, FC-BGA architecture based electronic packages and sockets for LGA packages used in servers including test vehicles.• Mechanical simulations and testing expertise in 1) down selecting architectures, processes and materials that provide the best yield and reliability, 2) identifying technical root causes for thermomechanical assembly issues and providing solution options.• Experience in leading teams, project management, working with suppliers and yield improvement.Skills - • Product design, FEA analysis, assembly & manufacturability, and lab testing. • Design for manufacturability, yield, and reliability of semiconductor packages.• Manufacturing statistics, design of experiments, and technical problem solving.• Hands-on expertise in thermo-mechanical characterization and reliability testing of electronic packages.• New test methodology development, fixture design, rapid prototyping, 3D printing• Software: ABAQUS, Solidworks, AutoCAD, JMP, Matlab, and C.Email id: shinde.m.h@gmail.com

Listed skills include Ls Dyna, Hypermesh, Primer Design, Microsoft Office, and 16 others.

Current workplace

Mandar Shinde's current company

Company context helps verify the profile and gives searchers a useful next step.

Intel Corporation
Intel Corporation
PhD (Mechanical Engineering) | Product Design Engineer| FEA Analyst | Stress Analysis | Material characterization | Additive Manufacturing
(408) 765-8080
Website
Employees
10
AeroLeads page
6 roles

Mandar Shinde work experience

A career timeline built from the work history available for this profile.

Packaging Engineer

Current

Santa Clara, California, US

  • Design owner of high-volume OEM sockets for Intel’s land grid array (LGA) server products.
  • Scope includes mechanical design using Solidworks, mechanical drawings and tolerance analysis, reliability modelling and validation (temperature cycling, shock, bake, vibe, SMT), releasing design guides and certifying.
  • Collaborate with various internal teams in a highly matrixed company to close design based on manufacturability, yield and reliability; solve thermo-mechanical assembly and reliability issues during development, LVM.
  • Perform thermomechanical simulation using FEA to design electronic packages that meet assembly processes, manufacturing yield and reliability (architecture, process and material selection).
  • Developed prototype for pick and place tool required to assemble protective caps on the socket
Apr 2023 - Present

Graduate Research Assistant

Tempe, AZ, US

  • Field driven design of cellular structures for maximizing energy absorption
  • Establish field-driven design and Finite Element simulation methodology for the large deformation analysis
  • Design cellular structures based on TPMS geometries to enhance energy absorption characteristics under quasi-static compression.
Aug 2018 - Mar 2023

Stress Analysis Intern

Eindhoven, Noord-Brabant, NL

  • FEA Simulation and validation of the Drop Test impact on the accelerometer package and MEMS structure.
  • Abaqus\Explicit is used to predict the acceleration levels at different locations in the accelerometer package.
May 2021 - Aug 2021

Stress Analysis Intern

Eindhoven, Noord-Brabant, NL

  • Simulation and validation of the Drop Test impact on the accelerometer package and MEMS structure.
  • Coordinated with the testing team to validate drop test simulation methodology using spherical balls.
  • Abaqus\Explicit is used to predict the acceleration levels at different locations in the accelerometer package.
  • Used sub modeling to analyze the behavior of MEMS structure due to predicted acceleration levels
May 2020 - Aug 2020

Crash Cae Engineer

Pune, Maharashtra, IN

  • Supported the Crashworthiness development of advanced vehicle structural concepts for various load cases in 4 Vehicle Programs.
  • Generated feasible vehicle design recommendations and worked with engineering functions, program teams, suppliers, manufacturing, and vehicle integration team to implement design changes as required for packaging.
  • Evaluated the GISSMO model used for failure prediction during crash simulations.
  • Supported crash testing with pre-test predictions, post-test tear-downs, and correlate CAE to test results.
Sep 2015 - Jul 2018

Assistant Manager

Columbus, Indiana, US

  • Spearheaded team of 30 personnel for regular and preventive maintenance of the plant.
  • Designed diesel storage calibration system for accurate monitoring of diesel and a fixture for accurate positioning of holes on a stator housing
  • Initiated drive of Autonomous maintenance to improve efficiency of machines, motivated and trained workforce for the successful implementation
  • Member of Global cross-functional team for improving standard operating process (SOP) of handling electronic components
Aug 2011 - Aug 2012
Team & coworkers

Colleagues at Intel Corporation

Other employees you can reach at intel.com. View company contacts for 10 employees →

3 education records

Mandar Shinde education

Doctor Of Philosophy - Phd, Mechanical Engineering

Arizona State University

Master Of Technology (M.Tech.), Engineering Design

Indian Institute Of Technology, Bombay

Bachelor Of Technology (B.Tech.), Mechanical Engineering

Coep Technological University
FAQ

Frequently asked questions about Mandar Shinde

Quick answers generated from the profile data available on this page.

What company does Mandar Shinde work for?

Mandar Shinde works for Intel Corporation.

What is Mandar Shinde's role at Intel Corporation?

Mandar Shinde is listed as PhD (Mechanical Engineering) | Product Design Engineer| FEA Analyst | Stress Analysis | Material characterization | Additive Manufacturing at Intel Corporation.

What is Mandar Shinde's email address?

AeroLeads has found 1 work email signal at @tatamotors.com for Mandar Shinde at Intel Corporation.

Where is Mandar Shinde based?

Mandar Shinde is based in Chandler, Arizona, United States while working with Intel Corporation.

What companies has Mandar Shinde worked for?

Mandar Shinde has worked for Intel Corporation, Arizona State University, Nxp Semiconductors, Tata Motors, and Cummins Inc..

Who are Mandar Shinde's colleagues at Intel Corporation?

Mandar Shinde's colleagues at Intel Corporation include Vaishali Shakya, Orit Ben Gera-Ron, Ron Sinicki, Logan Stewart, and Benjamin Rafalski.

How can I contact Mandar Shinde?

You can use AeroLeads to view verified contact signals for Mandar Shinde at Intel Corporation, including work email, phone, and LinkedIn data when available.

What schools did Mandar Shinde attend?

Mandar Shinde holds Doctor Of Philosophy - Phd, Mechanical Engineering from Arizona State University.

What skills is Mandar Shinde known for?

Mandar Shinde is listed with skills including Ls Dyna, Hypermesh, Primer Design, Microsoft Office, Microsoft Excel, Finite Element Analysis, Solid Mechanics, and Fracture Mechanics.

Find 750M verified contacts

Search by job title, company, industry, location, and seniority. Export verified B2B contact data when you need it.