Packaging Engineer
Current• Design owner of high-volume OEM sockets for Intel’s land grid array (LGA) server products.• Scope includes mechanical design using Solidworks, mechanical drawings and tolerance analysis, reliability modelling and validation (temperature cycling, shock, bake, vibe, SMT), releasing design guides and certifying external suppliers. • Collaborate with various internal teams in a highly matrixed company to close design based on manufacturability, yield and reliability; solve thermo-mechanical assembly and reliability issues during development, LVM and HVM.• Perform thermomechanical simulation using FEA to design electronic packages that meet assembly processes, manufacturing yield and reliability (architecture, process and material selection). • Developed prototype for pick and place tool required to assemble protective caps on the socket