Michael Coster Email & Phone Number

Essex Junction, Vermont, United States

I manage a Chemical Vapor Deposition (CVD) engineering team in the 200mm Fab at GF's Essex Junction, VT location. Our team owns the full scorecard of Quality, Cost and Delivery for our Oxide and Nitride Deposition tools. We interface with integration, characterization, maintenance and quality teams to provide tactical results and execute strategic improvements to drive our business forward!

Burlington, Vermont Area

Manage a Failure Analysis department specializing in Reliability and Packaging Fails.

Burlington, Vermont Area

I oversee physical failure analysis for ASIC product and IP qualifications as well as new technology reliability qualifications.

Essex Junction, Vt

In Nov 2012, I took a position within the Technology Qualifications group in Failure Analysis. We specialize in working on IBM's cutting edge technology nodes as well as supporting efforts to better understand older, still pertinent technologies. My responsibilities are diverse from fail diagnosis/mapping, developing the plan of action for isolation, and physical delayering and testing leading to defect analysis for root cause.Previously, I was responsible for electronic probing of devices at front-end and back-end of the line metal levels in failing test parts and field fail parts. I still support these efforts in a training/time of need situation.

· First project was building an SEM stage which included thermocouples for temperature control in AutoCAD · Next built an electrolysis cell using AutoCAD for use in fabricating anodized aluminum templates ­ Spent the Summer of 2007 working in the lab as part of The STAR Program sponsored by the Pennoni Honors College to finish development of a repeatable, and tunable process to grow templates for aid in nanowire fabrication · Aided a graduate student in the growth of core-shell nanowires of gold or silicon core and lead- zirconium-titanate (PZT) shells for piezoresponse measurements ­ Gold wires were grown via electrolysis after the templates I made were filled with a PZT precursor and baked; silicon was grown via CVD · Have electrically tested ZnO, GaAs, and CuS nanowires using a probe station ­ I contacted the ZnO and CuS nanowires using Electron Beam Lithography and metal evaporation while the GaAs wires were contacted in a FIB ­ By performing variant temperature IV measurements on the ZnO, I found transconductance and carrier concentration values · Previously helped a group in the Chemistry Department to electrically contact single-layer graphene chips for the development of superconductors · Responsible for maintenance of the group's website

· Worked as a Staff Engineer during my second Co-Op experience · Developed initial plans and recipes for the growth of GaN and ZnO nanowires via MOCVD and HVPE · Worked with XRF and XRD characterization systems · Fabricated and tested ZnO planar diodes

· Worked with a Gold-Barium Titanate (BTO) core-shell nanowire system · Goal was to measure radial polarization of a highly strained ferroelectric nanoshell · Won a Best Poster Award during the program's poster session