Automotive Connection Systems Engineer
Current
Sep 2023 - Present
AeroLeads people directory · profile
Michael Greeson Email & Phone Number
Automotive Connection Systems Engineer
at
BorgWarner
1 work email found
@schneider-electric.com
LinkedIn matched
✓ Verified May 2026
4 data sources
Profile completeness 100%
Current company
Role
Automotive Connection Systems Engineer
Location
Kokomo, Indiana, United States
Who is Michael Greeson? Overview
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Quick answer
Michael Greeson is listed as Automotive Connection Systems Engineer at BorgWarner, based in Kokomo, Indiana, United States. AeroLeads shows a work email signal at schneider-electric.com and a matched LinkedIn profile for Michael Greeson.
Michael Greeson previously worked as Component Engineer at Schneider Electric and Component Engineering Manager at Schneider Electric. Michael Greeson holds B.S., Electrical Engineering Technology from Purdue University.
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Email format at BorgWarner
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{first}.{last}@schneider-electric.com
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AeroLeads found 1 current-domain work email signal for Michael Greeson. Compare company email patterns before reaching out.
Profile bio
About Michael Greeson
Michael Greeson is a Automotive Connection Systems Engineer at BorgWarner. He possess expertise in lean manufacturing, manufacturing, continuous improvement, root cause analysis, engineering and 12 more skills. Colleagues describe him as "Mike was the Delphi Component Center of Expertise when I called on him regarding FCI connectors. Mike always did his homework ahead of time, and was always ready to test me with excellent questions about our products. He is level headed and fair in all of his dealings. If we had an issue, he was always willing to help work to a satisfactory solution for all parties. In short, he was an outstanding customer that had an excellent understanding of the products he was evaluating and how they would successfully be used."
Listed skills include Lean Manufacturing, Manufacturing, Continuous Improvement, Root Cause Analysis, and 13 others.
Current workplace
Michael Greeson's current company
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23 roles
Michael Greeson work experience
A career timeline built from the work history available for this profile.
Component Engineer
CurrentGlobal presence in building automation.North American Component Engineer for Buildings divisionOversee all component issues including EOL. Coordinate TAC global transition to Schneider Electric Component Data base. Developed reporting structure for NA R&D. DELPHI * Kokomo, IN 1984-2008Multinational world leader in mobile electronics and transportation.
Nov 2008 - Present
Component Engineering Manager
CurrentGlobal presence in building automation.North American Component Engineering Manger for Buildings divisionLead regional CEs in EU, NA and AP. Oversee all component issues including EOL. Coordinate TAC global transition to Schneider Electric Component Data base. Developed reporting structure for NA R&D. Business Unit Manager of Electronic Component.
Nov 2008 - Present
Engineering Team Lead
Engineering Team Lead for U.S. based R&D team. Personal responsibilities include Component Engineer, Eco-referent, Continuous Engineer for plants in all regions (quality, manufacturing, design, change control).
Feb 2009 - Sep 2023
Component Center Of Expertise
Delphi Corp.
Jul 1984 - Nov 2008
Component Engineer
Electronics And Safety
Prepare Delphi Corporate Drawings, Prepare Qualification Plans, Disposition PPAP, Manage Supplier Base, and audit supplier lab sites for all business units of E&S.Creation and management of Commodity Team Creation of Preferred Supplier Base Manage Supplier Change, including lead free qualification plans Understanding of GD&T, FMEA, Root Cause.
Jan 2001 - Jan 2004
Component Engineer
Electronics And Safety
Prepare Delphi Corporate Drawings, Prepare Qualification Plans, Disposition PPAP, Manage Supplier Base, and audit supplier lab sites for all business units of E&S.Creation and management of Commodity Team Creation of Preferred Supplier Base Manage Supplier Change, including lead free qualification plans Understanding of GD&T, FMEA, Root Cause.
Jan 2001 - Jan 2004
Component Engineer
Electronics And Safety
Prepare Delphi Corporate Drawings, Prepare Qualification Plans, Disposition PPAP, Manage Supplier Base, and audit supplier lab sites for all business units of E&S.Creation and management of Commodity Team Creation of Preferred Supplier Base Manage Supplier Change, including lead free qualification plans Understanding of GD&T, FMEA, Root Cause.
Jan 2001 - Jan 2004
Dicing Process Engineer
Delphi Corp
Specified, purchased and qualified new wafer dicing equipment. Provided support to manufacturing operations and area maintenance for shipment of 134+ part numbers to 14 customer sites in a union environment. Developed dicing applications, implemented new processes and procedures and coordinated continuous improvement on production processes. Training.
Jan 1998 - Jan 2001
Dicing Process Engineer
Delphi Corp
Specified, purchased and qualified new wafer dicing equipment. Provided support to manufacturing operations and area maintenance for shipment of 134+ part numbers to 14 customer sites in a union environment. Developed dicing applications, implemented new processes and procedures and coordinated continuous improvement on production processes. Training.
Jan 1998 - Jan 2001
Dicing Process Engineer
Delphi Corp
Specified, purchased and qualified new wafer dicing equipment. Provided support to manufacturing operations and area maintenance for shipment of 134+ part numbers to 14 customer sites in a union environment. Developed dicing applications, implemented new processes and procedures and coordinated continuous improvement on production processes. Training.
Jan 1998 - Jan 2001
Visual Process Engineer
Specified, purchased and qualified new automated vision inspection equipment. Provided process and equipment support to improve visual yield and drive continuous improvement. Implemented automated inspection equipment for defect detection. Developed and presented new processes and equipment designs. Instituted quality standards backed by statistical.
Jan 1998 - Jan 2001
Visual Process Engineer
Specified, purchased and qualified new automated vision inspection equipment. Provided process and equipment support to improve visual yield and drive continuous improvement. Implemented automated inspection equipment for defect detection. Developed and presented new processes and equipment designs. Instituted quality standards backed by statistical.
Jan 1998 - Jan 2001
Visual Process Engineer
Specified, purchased and qualified new automated vision inspection equipment. Provided process and equipment support to improve visual yield and drive continuous improvement. Implemented automated inspection equipment for defect detection. Developed and presented new processes and equipment designs. Instituted quality standards backed by statistical.
Jan 1998 - Jan 2001
Process Engineer
General Motors/Delco Electronics
Specified, purchased and qualified new Die Sorting pick and place equipment. Provided manufacturing support to back-end die sort operations for semiconductor business. Provided technical support for all three production shifts. Supervised area technicians and trained new operators. Developed and implemented new lean manufacturing processes. Designed and.
Jan 1989 - Jan 1998
Process Engineer
General Motors/Delco Electronics
Specified, purchased and qualified new Die Sorting pick and place equipment. Provided manufacturing support to back-end die sort operations for semiconductor business. Provided technical support for all three production shifts. Supervised area technicians and trained new operators. Developed and implemented new lean manufacturing processes. Designed and.
Jan 1989 - Jan 1998
Process Engineer
General Motors/Delco Electronics
Specified, purchased and qualified new Die Sorting pick and place equipment. Provided manufacturing support to back-end die sort operations for semiconductor business. Provided technical support for all three production shifts. Supervised area technicians and trained new operators. Developed and implemented new lean manufacturing processes. Designed and.
Jan 1989 - Jan 1998
Die Bond / Wire Bond
General Motors/Delco Electronics
Provided Manufacturing support to back-end semiconductor process, both epoxy and eutectic die bond, die bond to lead frame and ceramic substrate and flip chip, gold ball bonding and aluminum wedge bonding. Also supported oven bake process. Lead QC trainer, created and implemented Workmanship Standards.Creation and implementation of die bond and wire bond.
Jan 1984 - Jan 1989
Die Bond / Wire Bond
General Motors/Delco Electronics
Provided Manufacturing support to back-end semiconductor process, both epoxy and eutectic die bond, die bond to lead frame and ceramic substrate and flip chip, gold ball bonding and aluminum wedge bonding. Also supported oven bake process. Lead QC trainer, created and implemented Workmanship Standards.Creation and implementation of die bond and wire bond.
Jan 1984 - Jan 1989
Die Bond / Wire Bond
General Motors/Delco Electronics
Provided Manufacturing support to back-end semiconductor process, both epoxy and eutectic die bond, die bond to lead frame and ceramic substrate and flip chip, gold ball bonding and aluminum wedge bonding. Also supported oven bake process. Lead QC trainer, created and implemented Workmanship Standards.Creation and implementation of die bond and wire bond.
Jan 1984 - Jan 1989
Meter Department
Kokomo Water Company
Designed erosion control structures, Presented new cropping methods to farmers, surveying, Coordination of Field Days that brought together chemical and machinery manufacturers, media, and farmers.
Dec 1982 - Jan 1984
Meter Department
Kokomo Water Company
Designed erosion control structures, Presented new cropping methods to farmers, surveying, Coordination of Field Days that brought together chemical and machinery manufacturers, media, and farmers. Hydroponic greenhouse experience on family farm.
Jan 1982 - Jan 1984
Soil Conservation Technician
Soil Conservation Service, Usda
Designed erosion control structures, Presented new cropping methods to farmers, surveying, Coordination of Field Days that brought together chemical and machinery manufacturers, media, and farmers. Hydroponic greenhouse experience on family farm.** ** **
Jan 1982 - Jan 1984
8 education records
Michael Greeson education
B.S., Electrical Engineering Technology
Purdue University
Bs, Electrical Engineering Technology
Purdue University
Bs, Electrical Engineering Technology
Purdue University
Bs, Electrical Engineering Technology
Purdue University
B.S., Agronomy
Purdue University
Bs, Agronomy
Purdue University
Bs, Agronomy
Purdue University
Bs, Agronomy
Purdue University
FAQ
Frequently asked questions about Michael Greeson
Quick answers generated from the profile data available on this page.
What company does Michael Greeson work for?
Michael Greeson works for BorgWarner.
What is Michael Greeson's role at BorgWarner?
Michael Greeson is listed as Automotive Connection Systems Engineer at BorgWarner.
What is Michael Greeson's email address?
AeroLeads has found 1 work email signal at @schneider-electric.com for Michael Greeson at BorgWarner.
Where is Michael Greeson based?
Michael Greeson is based in Kokomo, Indiana, United States while working with BorgWarner.
What companies has Michael Greeson worked for?
Michael Greeson has worked for Borgwarner, Schneider Electric, Delphi Corp., Electronics And Safety, and Delphi Corp.
How can I contact Michael Greeson?
You can use AeroLeads to view verified contact signals for Michael Greeson at BorgWarner, including work email, phone, and LinkedIn data when available.
What schools did Michael Greeson attend?
Michael Greeson holds B.S., Electrical Engineering Technology from Purdue University.
What skills is Michael Greeson known for?
Michael Greeson is listed with skills including Lean Manufacturing, Manufacturing, Continuous Improvement, Root Cause Analysis, Engineering, Semiconductors, Fmea, and Spc.
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