Michael Greeson Email & Phone Number

Auburn Hills, Michigan, Us

Rueil Malmaison, Paris, Fr

Global presence in building automation.North American Component Engineer for Buildings divisionOversee all component issues including EOL. Coordinate TAC global transition to Schneider Electric Component Data base. Developed reporting structure for NA R&D. DELPHI * Kokomo, IN 1984-2008Multinational world leader in mobile electronics and transportation components and systems technology. Center of Expertise, Electronics and Safety (2004 - 2008)Connection System Technical Lead for Entertainment & Communications, Body Security, HVAC and Clusters Business Units. The role involves managing purchasing, Component Engineering, Quality Engineering, Manufacturing Engineering and supplier base for the needs of a product development. Support both mechanical, physical and electrical aspects of connection system, including Failure Analysis.Saved $1.9M over three years utilizing proper technology and sourcing Will realize $1.5M savings per year with implementation of whisker resistant tin plated FFC (replacing gold plate) Mentor all new Connection System Component Engineers Maintain Delphi Design Standards for Connection Systems Best Practices

Rueil Malmaison, Paris, Fr

Global presence in building automation.North American Component Engineering Manger for Buildings divisionLead regional CEs in EU, NA and AP. Oversee all component issues including EOL. Coordinate TAC global transition to Schneider Electric Component Data base. Developed reporting structure for NA R&D. Business Unit Manager of Electronic Component Selection and Qualification. DELPHI * Kokomo, IN 1984-2008Multinational world leader in mobile electronics and transportation components and systems technology. Center of Expertise, Electronics and Safety (2004 - 2008)Connection System Technical Lead for Entertainment & Communications, Body Security, HVAC and Clusters Business Units. The role involves managing purchasing, Component Engineering, Quality Engineering, Manufacturing Engineering and supplier base for the needs of a product development. Support both mechanical, physical and electrical aspects of connection system, including Failure Analysis.Saved $1.9M over three years utilizing proper technology and sourcing Will realize $1.5M savings per year with implementation of whisker resistant tin plated FFC (replacing gold plate) Mentor all new Connection System Component Engineers Maintain Delphi Design Standards for Connection Systems Best Practices

Rueil Malmaison, Paris, Fr

Engineering Team Lead for U.S. based R&D team. Personal responsibilities include Component Engineer, Eco-referent, Continuous Engineer for plants in all regions (quality, manufacturing, design, change control).

Prepare Delphi Corporate Drawings, Prepare Qualification Plans, Disposition PPAP, Manage Supplier Base, and audit supplier lab sites for all business units of E&S.Creation and management of Commodity Team Creation of Preferred Supplier Base Manage Supplier Change, including lead free qualification plans Understanding of GD&T, FMEA, Root Cause Analysis, Design for Six Sigma

Prepare Delphi Corporate Drawings, Prepare Qualification Plans, Disposition PPAP, Manage Supplier Base, and audit supplier lab sites for all business units of E&S.Creation and management of Commodity Team Creation of Preferred Supplier Base Manage Supplier Change, including lead free qualification plans Understanding of GD&T, FMEA, Root Cause Analysis, Design for Six Sigma

Prepare Delphi Corporate Drawings, Prepare Qualification Plans, Disposition PPAP, Manage Supplier Base, and audit supplier lab sites for all business units of E&S.Creation and management of Commodity Team Creation of Preferred Supplier Base Manage Supplier Change, including lead free qualification plans Understanding of GD&T, FMEA, Root Cause Analysis, Design for Six Sigma

Specified, purchased and qualified new wafer dicing equipment. Provided support to manufacturing operations and area maintenance for shipment of 134+ part numbers to 14 customer sites in a union environment. Developed dicing applications, implemented new processes and procedures and coordinated continuous improvement on production processes. Training unionized production operators on the use of production equipment. Created training documentation and implemented an operator certification program on the wafer dicing equipment.Assisted in development of industry's first production auto mounting equipment with a start up vendor in Hong Kong. Assisted in the development and patent of a new wafer dicing additive. Implemented new wafer dicing equipment from Disco Corporation in Japan. Set-up production sawing processes on new type of manufacturing equipment. Performed technical writing of work specification for new processes and equipment. Eliminated $480,000 annually in labor costs and $225,000 in scrap by implementing industry's first automatic wafer mounting system and patenting a new wafer dicing additive. Reduced critical labor costs related to semiconductor manufacturing by enabling competition with low-cost overseas sites by researching and purchasing automatic equipment

Specified, purchased and qualified new wafer dicing equipment. Provided support to manufacturing operations and area maintenance for shipment of 134+ part numbers to 14 customer sites in a union environment. Developed dicing applications, implemented new processes and procedures and coordinated continuous improvement on production processes. Training unionized production operators on the use of production equipment. Created training documentation and implemented an operator certification program on the wafer dicing equipment.Assisted in development of industry's first production auto mounting equipment with a start up vendor in Hong Kong. Assisted in the development and patent of a new wafer dicing additive. Implemented new wafer dicing equipment from Disco Corporation in Japan. Set-up production sawing processes on new type of manufacturing equipment. Performed technical writing of work specification for new processes and equipment. Eliminated $480,000 annually in labor costs and $225,000 in scrap by implementing industry's first automatic wafer mounting system and patenting a new wafer dicing additive. Reduced critical labor costs related to semiconductor manufacturing by enabling competition with low-cost overseas sites by researching and purchasing automatic equipment

Specified, purchased and qualified new wafer dicing equipment. Provided support to manufacturing operations and area maintenance for shipment of 134+ part numbers to 14 customer sites in a union environment. Developed dicing applications, implemented new processes and procedures and coordinated continuous improvement on production processes. Training unionized production operators on the use of production equipment. Created training documentation and implemented an operator certification program on the wafer dicing equipment.Assisted in development of industry's first production auto mounting equipment with a start up vendor in Hong Kong. Assisted in the development and patent of a new wafer dicing additive. Implemented new wafer dicing equipment from Disco Corporation in Japan. Set-up production sawing processes on new type of manufacturing equipment. Performed technical writing of work specification for new processes and equipment. Eliminated $480,000 annually in labor costs and $225,000 in scrap by implementing industry's first automatic wafer mounting system and patenting a new wafer dicing additive. Reduced critical labor costs related to semiconductor manufacturing by enabling competition with low-cost overseas sites by researching and purchasing automatic equipment

Gillingham, United Kingdom, Gb

Specified, purchased and qualified new automated vision inspection equipment. Provided process and equipment support to improve visual yield and drive continuous improvement. Implemented automated inspection equipment for defect detection. Developed and presented new processes and equipment designs. Instituted quality standards backed by statistical process control. Interacted with operations, engineering and equipment vendors. Documented new processes and procedures. Wrote QS9000 documentation and trained operators.Saved $500,000 annually in operator costs and by converting from manual to automated inspection process. Improved visual losses 10% by implementing automated visual equipment and instituting new quality standards. Die Sort / Tape and

Gillingham, United Kingdom, Gb

Specified, purchased and qualified new automated vision inspection equipment. Provided process and equipment support to improve visual yield and drive continuous improvement. Implemented automated inspection equipment for defect detection. Developed and presented new processes and equipment designs. Instituted quality standards backed by statistical process control. Interacted with operations, engineering and equipment vendors. Documented new processes and procedures. Wrote QS9000 documentation and trained operators.Saved $500,000 annually in operator costs and by converting from manual to automated inspection process. Improved visual losses 10% by implementing automated visual equipment and instituting new quality standards. Die Sort / Tape and

Gillingham, United Kingdom, Gb

Specified, purchased and qualified new automated vision inspection equipment. Provided process and equipment support to improve visual yield and drive continuous improvement. Implemented automated inspection equipment for defect detection. Developed and presented new processes and equipment designs. Instituted quality standards backed by statistical process control. Interacted with operations, engineering and equipment vendors. Documented new processes and procedures. Wrote QS9000 documentation and trained operators.Saved $500,000 annually in operator costs and by converting from manual to automated inspection process. Improved visual losses 10% by implementing automated visual equipment and instituting new quality standards. Die Sort / Tape and

Specified, purchased and qualified new Die Sorting pick and place equipment. Provided manufacturing support to back-end die sort operations for semiconductor business. Provided technical support for all three production shifts. Supervised area technicians and trained new operators. Developed and implemented new lean manufacturing processes. Designed and patented new sorting equipment and improved existing equipment. Tracked and monitored production output and quality. Resolved and reported quality issues. Maintained documentation, organized records and created performance reports and presented daily metrics in production meetings. Saved $2.1+ million over a two-year period by designing and patenting new carrier tape design and vacuum expansion at sort to eliminate multiple critical customer issues. Increased throughput 40% by implementing electronic wafer mapping; developed and patented new expansion rings and carrier tapes to decrease process cycle time. Significantly reduced labeling spills to customer sites by designing custom software to error proof sort, implementing lean cells at all sort processes and instituting a factory automation system. Implemented automated equipment output inspection to meet critical customer requirements for components. Resolved critical issues by utilizing a structured PFMEA approach to processes, designing new tooling and teaming with operators to identify undetected problems effecting quality and operational effectiveness. Reduced critical labor costs related to semiconductor manufacturing by implementing automatic product handling and in-line vision inspection.

Specified, purchased and qualified new Die Sorting pick and place equipment. Provided manufacturing support to back-end die sort operations for semiconductor business. Provided technical support for all three production shifts. Supervised area technicians and trained new operators. Developed and implemented new lean manufacturing processes. Designed and patented new sorting equipment and improved existing equipment. Tracked and monitored production output and quality. Resolved and reported quality issues. Maintained documentation, organized records and created performance reports and presented daily metrics in production meetings. Saved $2.1+ million over a two-year period by designing and patenting new carrier tape design and vacuum expansion at sort to eliminate multiple critical customer issues. Increased throughput 40% by implementing electronic wafer mapping; developed and patented new expansion rings and carrier tapes to decrease process cycle time. Significantly reduced labeling spills to customer sites by designing custom software to error proof sort, implementing lean cells at all sort processes and instituting a factory automation system. Implemented automated equipment output inspection to meet critical customer requirements for components. Resolved critical issues by utilizing a structured PFMEA approach to processes, designing new tooling and teaming with operators to identify undetected problems effecting quality and operational effectiveness. Reduced critical labor costs related to semiconductor manufacturing by implementing automatic product handling and in-line vision inspection.

Specified, purchased and qualified new Die Sorting pick and place equipment. Provided manufacturing support to back-end die sort operations for semiconductor business. Provided technical support for all three production shifts. Supervised area technicians and trained new operators. Developed and implemented new lean manufacturing processes. Designed and patented new sorting equipment and improved existing equipment. Tracked and monitored production output and quality. Resolved and reported quality issues. Maintained documentation, organized records and created performance reports and presented daily metrics in production meetings. Saved $2.1+ million over a two-year period by designing and patenting new carrier tape design and vacuum expansion at sort to eliminate multiple critical customer issues. Increased throughput 40% by implementing electronic wafer mapping; developed and patented new expansion rings and carrier tapes to decrease process cycle time. Significantly reduced labeling spills to customer sites by designing custom software to error proof sort, implementing lean cells at all sort processes and instituting a factory automation system. Implemented automated equipment output inspection to meet critical customer requirements for components. Resolved critical issues by utilizing a structured PFMEA approach to processes, designing new tooling and teaming with operators to identify undetected problems effecting quality and operational effectiveness. Reduced critical labor costs related to semiconductor manufacturing by implementing automatic product handling and in-line vision inspection.

Provided Manufacturing support to back-end semiconductor process, both epoxy and eutectic die bond, die bond to lead frame and ceramic substrate and flip chip, gold ball bonding and aluminum wedge bonding. Also supported oven bake process. Lead QC trainer, created and implemented Workmanship Standards.Creation and implementation of die bond and wire bond process specifications Monitoring of power transmission and implementation of Power Conditioners to eliminate pattern recognition errors

Provided Manufacturing support to back-end semiconductor process, both epoxy and eutectic die bond, die bond to lead frame and ceramic substrate and flip chip, gold ball bonding and aluminum wedge bonding. Also supported oven bake process. Lead QC trainer, created and implemented Workmanship Standards.Creation and implementation of die bond and wire bond process specifications Monitoring of power transmission and implementation of Power Conditioners to eliminate pattern recognition errors

Provided Manufacturing support to back-end semiconductor process, both epoxy and eutectic die bond, die bond to lead frame and ceramic substrate and flip chip, gold ball bonding and aluminum wedge bonding. Also supported oven bake process. Lead QC trainer, created and implemented Workmanship Standards.Creation and implementation of die bond and wire bond process specifications Monitoring of power transmission and implementation of Power Conditioners to eliminate pattern recognition errors

Designed erosion control structures, Presented new cropping methods to farmers, surveying, Coordination of Field Days that brought together chemical and machinery manufacturers, media, and farmers.

Designed erosion control structures, Presented new cropping methods to farmers, surveying, Coordination of Field Days that brought together chemical and machinery manufacturers, media, and farmers. Hydroponic greenhouse experience on family farm.

Designed erosion control structures, Presented new cropping methods to farmers, surveying, Coordination of Field Days that brought together chemical and machinery manufacturers, media, and farmers. Hydroponic greenhouse experience on family farm.** ** **

B.S., Electrical Engineering Technology

Bs, Electrical Engineering Technology

Bs, Electrical Engineering Technology

Bs, Electrical Engineering Technology

B.S., Agronomy

Bs, Agronomy

Bs, Agronomy

Bs, Agronomy