Michael Lay Email & Phone Number

Seattle, Wa, Us

Kent, Wa, Us

Menlo Park, Ca, Us

Electronic Hardware design for Meta Reality Labs products.

Seattle, Wa, Us

• Responsible for design and implementation of compute module hardware for autonomous robot• Integrated Software, Mechanical, Power, and Thermal stakeholders into the compute module design process.• Drove cable harness and sensor interface signaling design to minimize cost, weight, and EMI footprint• Work with Sourcing and Sustaining teams to resolve field issues and supply chain issues with existing robots

San Diego, Ca, Us

• Responsible for Instrument Safety and EMC Compliance across 3 different projects, driving safety/compliance up-front design work, coordinating design with cross-functional team, documentation, and successful on-schedule certification• Performed detailed safety single-fault analysis for multiple thermal and motion systems • Designed high precision thermal measurement system and high-powered TEC drive circuit to meet very tight thermal stability and ramping requirements• Responsible for the EE architecture of a precision motion stage utilizing both stepper and brushed DC motors• Characterized and validated Wifi and RFID implementations in IVD class instruments• Created and validated power budgets at the instrument and sub-system/board level to drive power supply sizing and load management• Drove board-level specs and engineering validation test team across 3 different platforms • Created detailed board-level theory of operation, design documentation, and troubleshooting guides as part of handoff packages to manufacturing and sustaining engineering teams

San Diego, Ca, Us

Lexington, Kentucky, Us

• Member of the global engineering team, tasked with Electromechanical Product Development and Advanced Technology development within the organization• Managed an external vendor’s development of an RF remote control utilizing Bluetooth and an LCD Graphical User Interface, serving as the technical lead for the project and the liaison between the internal cross-functional team and the development engineers working for the vendor.• Mapped out user interface flows for Graphical remote controls and indicator lamp and button-based remote controls for mechanized and climate-controlled beds. Ensured that all use flows had fully defined entry and exit points and that the desired user experience was achieved. • Integrated the communications protocol for wireless remote controls across multiple external vendors, handling coordination between vastly different codebases and driving interface bugs to resolution. • Created the high-level electrical architecture and spec requirements for a scalable family of adjustable base bed controllers. Ensured that the overall design was modular and would support variable feature sets from product to product with minimal SKU count and optimized BOM cost. • Created and maintained a cost-per-function BOM matrix for all technologies within the engineering team, allowing quick creation of product cost estimates for internal marketing and sourcing teams. • Evaluated various technologies and RF frequencies (433 MHz RF, Bluetooth, BTLE, Zigbee, RF4CE, Nordic Gazell) for the company’s worldwide wireless remote strategy, and provided direction to the business on the best path to pursue.

Lexington, Kentucky, Us

• Created electrical schematics and oversaw PCB layout for 3 generations of high-volume consumer printers. These devices were realized with multiple 2, 4, and 6 layer PCBAs, and passed all relevant UL safety, USB, Ethernet, 802.11b/g/n, CISPR22, and FCC certifications prior to being launched into production. • Responsible for the design of the LED illumination for high-speed CCD and CMOS document scanning systems. Sized appropriate drive circuitry, board layout and optical characteristics (CIE coordinates, PRNU, CCD voltage response, noise/aliasing, thermal drift, etc.) to meet the customer requirements while still hitting cost targets.• Collaborated with manufacturing and development teams at different ODM partners in Asia. Provide consistent technical leadership and cross-divisional training with co-workers from the Philippines, specifically in the areas of USB compliance testing, Electromagnetic Compatibility, Signal Quality, Thermal and Electrical Derating, and HALT testing• Completed thermal and electrical derating guidelines for ASICs, DDR1/DDR2/DDR3 memories, and analog circuit components on printed circuit boards by adapting industry standard guidelines and “in circuit examination” of failed/recovered printers from the field. Provided recommendations to management on how the derating feedback loop could be more appropriately closed for future product cycles.• Lead of Electromagnetic Compatibility testing and qualification for one of several product teams. Define test systems/procedures and provide testing and debug support for CISPER22 and FCC consumer product requirements. • Lead of USB 2.0 testing and qualification for several product teams. Define test systems/procedures and provide testing and debug support for all USB testing on inkjet products. Significant involvement in test methodology development.

Austin , Texas, Us

Provided phone tech support to customers of NI LabView, and in the process learned the ins and outs of the product itself.Updated and improved the internal training materials for the Modular Instrumentation Product Line. This material was specifically geared for supporting applications engineers working to resolve customer issues in the field.

Washington, Dc, Us

Troubleshot and completed a computerized “Checkout Cart” for PLC controllers used in rocket testing. Created a graphical interface for the control of the PLC units.