AeroLeads people directory · profile

Michael Orgil Email & Phone Number

Senior Process Engineer Chip Attach Wirebond and Customer Focus Engineer and WB TFT Lead at Amkor Technology
Location: Philippines 6 work roles 2 schools
1 work email found @amkor.com LinkedIn matched
✓ Verified August 2026 4 data sources Profile completeness 100%

Contact Signals · 1 work email

Work email m****@amkor.com
LinkedIn Profile matched
3 free lookups remaining · No credit card
Current company
Role
Senior Process Engineer Chip Attach Wirebond and Customer Focus Engineer and WB TFT Lead
Location
Philippines
Company size

Who is Michael Orgil? Overview

A concise factual answer block for searchers comparing this professional profile.

Quick answer

Michael Orgil is listed as Senior Process Engineer Chip Attach Wirebond and Customer Focus Engineer and WB TFT Lead at Amkor Technology, a with 7885 employees, based in Philippines. AeroLeads shows a work email signal at amkor.com and a matched LinkedIn profile for Michael Orgil.

Michael Orgil previously worked as Senior Process Engineer Chip Attach Wirebond/Customer Focus Engineer/WB TFT Lead at Amkor Technology and Senior Process Engineer Chip Attach Wirebond at Texas Instruments. Michael Orgil holds Bachelor Of Science (B.Sc.), Electrical, Electronics And Communications Engineering from Polytechnic University Of The Philippines.

Company email context

Email format at Amkor Technology

This section adds company-level context without repeating Michael Orgil's masked contact details.

{first}.{last}@amkor.com
89% confidence

AeroLeads found 1 current-domain work email signal for Michael Orgil. Compare company email patterns before reaching out.

Profile bio

About Michael Orgil

Michael Orgil is a Senior Process Engineer Chip Attach Wirebond and Customer Focus Engineer and WB TFT Lead at Amkor Technology. He possess expertise in semiconductors, semiconductor industry, manufacturing, spc, fmea and 2 more skills.

Listed skills include Semiconductors, Semiconductor Industry, Manufacturing, Spc, and 3 others.

Current workplace

Michael Orgil's current company

Company context helps verify the profile and gives searchers a useful next step.

Amkor Technology
Amkor Technology
Senior Process Engineer Chip Attach Wirebond and Customer Focus Engineer and WB TFT Lead
Philippines
Website
Employees
7885
AeroLeads page
6 roles

Michael Orgil work experience

A career timeline built from the work history available for this profile.

Senior Process Engineer Chip Attach Wirebond And Customer Focus Engineer And Wb Tft Lead

Philippines

Senior Process Engineer Chip Attach Wirebond/Customer Focus Engineer/Wb Tft Lead

Responsibilities:
1. Heads-up potential quality/low yield issue to customer and provide risk assessment/corrective actions.
2. Train and certify wirebond technicians and operators.
3. Monitor & analyze process performance and generate actions to address the issue.
4. Coordinate with NPI, process and maintenance engineers on on-going device/machine qualification and process changes to be implemented in the production.
5. Leads a group of process engineers handling Bosch, Global Foundries, Melexis and Microchip account.
6. Interface with different customers on a weekly basis to discuss yield, quality and process issues/improvement plans.
7. Review and approval of reports (8D, MRB, ESR).
8. Lead quality and process improvement actions to meet/exceed the target yield.
9. Process simplification and elimination of non-value activities (NVA).
10. Review and update of customer process flow (CPF) and control plan.
11. Perform gap analysis on generic control plan, documents vs. customer specifications vs. actual practice.
12. Handle several accounts for multinational companies and serves as Customer Focus Engineer for MLF package covering FOL-EOL-Test stations.
13. Documentation of all generated corrective actions utilizing specs such as: FMEA, Control Plan, Set-up Checklist, OCAP, etc.
14. Analyze customer complains, mis-operations, line issues and come up with corrective actions that will prevent recurrence of problems.
15. Spearhead the quality, productivity, and cost effectiveness programs.
16. Ensure that all manufacturing indices are within or exceeds the customer’s goal.
17. Use problem solving tools like Problem Solving Methodology, 8D, RCA, FA, etc. in handling problems in the line and customer complains.
18. Document urgent special customer requirements thru SWR, ECN and ensure everyone in the concerned process is informed of these requirements.

Senior Process Engineer Chip Attach Wirebond

Responsibilities:
1. Conduct DOE on devices with high rejection rate due to lifted ball/stitch defect.
2. Review and update wirebond specs, OCAP, process flow, FMEA and control plan.
3. Generate 8D reports on critical line issues.
4. Spearhead qualification of Pro Stitch Plus for KNS bonders.
5. Drive quality/productivity improvement thru probond/prostitch approach.
6. Use problem solving tools like RCA, fishbone diagram, fault tree analysis, FA, etc. in handling line
issues.
7. Monitor hold lots status and perform required actions to release from hold.
8. Attend and verify line issues and come up with action plans.
9. Update and re-certify existing WB programs to include lessons learned.
10. Coordinate and work closely with supplier for process improvements.
11. Generate and review TECN/ECN prior implementation of new parameter.

Mar 2015 - Nov 2015

Senior Npi Engineer

Johore, Malaysia

Responsibilities:
1. Spearhead gold to copper wire conversion of existing devices.
2. Perform KNS Iconn/Iconn Plus portability study to align target output responses of different
devices/pad technology.
3. Generate wirebond program using AutoOLP software.
4. Evaluate and study capillary life extension from 400k to 800k bond count.
5. Conduct Design of Experiment for new bond pad technology and for new leadframe finishing.
6. Ensure smooth transition/transfer of product/device from development to production.
7. Review and update process specifications, FMEA, control plan and OCAP.
8. Generate 8D for internal/external customer complains.
9. Evaluate and qualify new materials as part of cost saving initiative.
10. Qualify and buy-off new machine and WCTP design.
11. Focus on new device/package/pad technology development at wirebond (Cu).
12. Provide technical support and assistance to production line issues.
13. Generate ball placement coordinate program for new CuRDL devices.
14. Review and perform validation on new device/package with die design rule violation and
bonding diagram waiver.

Mar 2013 - Mar 2015

Wb Process Engineer

Paranaque Manila, Philippines

Responsibilities: 1. Generate, review and interpret process specifications and other related documents.2. Conceive, source and test alternative and new methods/processes to improve manufacturability, yield and quality.3. Provide effective and efficient in-process problem investigation, defect and yield analysis, containment actions and measures/controls to correct and prevent problem.4. Optimize process parameters in order to improve product yield, process capabilities and/or production cycle time.5. Characterize, test and qualify material properties, yield and manufacturability behavior and find a better material substitute thereafter.6. Assist in tool and equipment design, upgrading, set-up and qualification prior to production use.7. Generate and maintain yield data per product type on a weekly/monthly basis and prepare activity reports and to plan, design and coordinate activities to improve yield.8. Supervise and monitor engineering lots/runs covering changes in process, device, package, material and design that may affect assembly.9. Develop FMEA or Containment FMEA for applicable process and to conduct review and update of existing FMEA.10. Generate 8D for customer returns and catastrophic and reliability rejects at final test exceeding pre-determined trigger points.11. Monitor, analyze and minimize/eliminate occurrence of catastrophic and reliability rejects on production lots.12. Lead, supervise and monitor the activities of 3 Process Analysts/Technicians.13. Use problem solving tools such as Process Mapping, Fishbone Diagram (Ishikawa), FTA, 5 why’s in rootcause analysis.

Jun 2011 - Jun 2012

Process Engineer

Muntinlupa City, Philippines

Responsibilities:1. Qualify and buy-off new devices, equipment, machines, and materials.2. Conduct MSA study on new equipments and machines.3. Analyze customer complains, mis-operations, line issues and come up with corrective actions that will prevent recurrence of problems. 4. Spearhead the quality, productivity, and cost effectiveness programs.5. Documentation of all generated corrective actions utilizing specs such as the: FMEA, Control Plan, Set-up Checklist, OCAP, etc.6. Attend to all customer issues and provide customer an update regarding current indices.7. Ensure that all manufacturing indices are within or exceeds the customer’s goal.8. Monitor hold lot status and coordinate activities needed to release from hold.9. Use problem solving tools like DOE, Problem Solving Methodology, 8D, RCA, FA, etc. in handling problems in the line and customer complains.10. Gather and review data to come up with process improvement plans to further improve line indices.11. Document urgent special customer requirements thru SWR, ECN and ensure everyone in the concerned process is informed of these requirements.12. Perform audit on compliance of team members to Standard Operating Procedure and set specifications (customer, process, etc.).13. Prepare and orient line personnel on the scheduled/incoming audit/s.14. Monitor and analyze data on eSPC to ensure conformance of product produced.15. Responsible in maintaining Cpk goal of >2.0 for MQFP/SSOP Wirebond station. 16. Handle several accounts for multinational companies and serves as Customer Focus Engineer for MQFP package.17. Support NPI for Gold wirebonding process, materials & equipment qualification and development.

Jun 2005 - Oct 2010
Team & coworkers

Colleagues at Amkor Technology

Other employees you can reach at amkor.com. View company contacts for 7885 employees →

2 education records

Michael Orgil education

Education record

Muntinlupa National High School
FAQ

Frequently asked questions about Michael Orgil

Quick answers generated from the profile data available on this page.

What company does Michael Orgil work for?

Michael Orgil works for Amkor Technology.

What is Michael Orgil's role at Amkor Technology?

Michael Orgil is listed as Senior Process Engineer Chip Attach Wirebond and Customer Focus Engineer and WB TFT Lead at Amkor Technology.

What is Michael Orgil's email address?

AeroLeads has found 1 work email signal at @amkor.com for Michael Orgil at Amkor Technology.

Where is Michael Orgil based?

Michael Orgil is based in Philippines while working with Amkor Technology.

What companies has Michael Orgil worked for?

Michael Orgil has worked for Amkor Technology, Texas Instruments, Stmicroelectronics, and Allegro Microsystems, Inc..

Who are Michael Orgil's colleagues at Amkor Technology?

Michael Orgil's colleagues at Amkor Technology include Eddie Ho 何松翰, Henry Garcia, Mira Shaine Turallo, 葉智恩, and Christian Orbiso.

How can I contact Michael Orgil?

You can use AeroLeads to view verified contact signals for Michael Orgil at Amkor Technology, including work email, phone, and LinkedIn data when available.

What schools did Michael Orgil attend?

Michael Orgil holds Bachelor Of Science (B.Sc.), Electrical, Electronics And Communications Engineering from Polytechnic University Of The Philippines.

What skills is Michael Orgil known for?

Michael Orgil is listed with skills including Semiconductors, Semiconductor Industry, Manufacturing, Spc, Fmea, Electronics, and Design Of Experiments.

Find 750M verified contacts

Search by job title, company, industry, location, and seniority. Export verified B2B contact data when you need it.

People with similar names

Check these profiles if this is not the Michael Orgil you were looking for.

View similar profiles