Michael Simcoe Email & Phone Number

California, United States

OO

• High Performance Analog, Infrastructure & WiFi Team
• Designs supported: 3.4-3.8G 8W Doherty PA Module with novel thermal management;3.4-4G 10W Doherty PA Module with 500MHz DPD BW; 2W FEM WiFi PA inHBT/GaN/Laminate with novel Doherty structure and integrated thermal.
• Developed RF + Electrothermal design flow for FEMs in HBT/GaN/Laminate
• Full 3D EM design flow in FEM/HFSS: unified simulation of laminate, packaging, bondwires, SMDs, IPDs, ICs with mixed HBT/GaN/Laminate technologies
• Developed behavioral model flow using extracted modulated model data and polynomialfitting that enabled fast analysis of FEM performance at the system level using Simulink
• Created automated measurement data extraction scripts in Matlab, AEL, and Unix shell

Malta, NY, US

• Created reference designs and flows across multiple advanced technology nodes (FDSOI,FinFET) showcasing technology capabilities at the block level (PA, LNA, Switch)
• Designed a 6GHz WiFi stacked differential PA with record FDSOI Psat 28dBm hitting allcritical EVM linearity targets for 802.11ax using 22nm 22FDX
• Designed a 28GHz LNA with record 1.4dB noise figure, 28dB gain in 12nm FinFET (12LP)
• RF Module FEM design: PA and Switch (22FDX) with LNA (12LP) integrated into a FrontEnd Module (FEM) using Virtuoso RF SiP tool. Silicon interposer; BGA; laminate
• Developed an automated design tool in Skill, Matlab, Python that instantiates parametricdevices and modifies CDF, including layout/LVS/PEX, with automatic data post-processing
• Developed a new design automation tool that migrates/ports designs across nodesautomatically, including schematic, device sizing, simulation, layout, PEX, and LVS

Neubiberg, München, DE

• Principal developer of new RFIC technology platform, responsible for development andplatform integration, including passives, active cells, and PDK creation
• Design of high-power multistage high-gain (>30dB), wideband (1.8-2.2GHz) RFIC leadproducts in LD10 platform with first-pass success: PTMC21040 2x20; PTMC21060 2x30Wsymmetric; PTMC21061 20W+40W asymmetric (Doherty).
• GaN product design and optimization for 5G, including 3.5GHz and 4.5GHz multi-stage GaNMMIC designs using GaN PDK (Cree, Wolfspeed)
• Design of parts across multiple technology platforms: LD9/LD9LF/LD50/LD10/LD11/LD12
• Development of new LDMOS technology platforms from the beginning including all aspectsof process, design flow, PDK, and qualification (LD10IC, LDH1IC 50V)
• Development of IC process passives, including the LD12IC high-Q IPD platform

Austin, Texas, US

• Complete RFIC design cycle experience of power amplifiers
• Design specification/targets compliance doc and simulation (ADS, Momentum, HFSS)
• Process Design Kit, S-parameters, large signal modeling, harmonic balance, stability
• Layout (die/reticle); DRC, LVS; thermal tracking circuits; ESD placement
• Packaging, die and wire bond; die option and DOE strategies
• Electromagnetic simulation, optimization, extraction of IC process passives and packageparastics using electromagnetic tools (HFSS, Momentum)

Chicago, Illinois, US

• Complete antenna design cycle responsibility, including full RF CAD simulation usingAnsoft HFSS and XFDTD (bandwidth, efficiency, radiation pattern, diversity, SAR)
• Antenna design and placement for optimal bandwidth, efficiency, SAR; IFA, PIFA, FJA,designs; diversity antenna; antenna tuning and optimization of PCB matching networks
• Prototype fabrication and measurement: S-parameters, efficiency, radiation pattern, TRP, TIS
• Design of complete multi antenna solutions: stamped, flex, multiband PIFA, GPS, WLAN
• Antenna anechoic chamber measurements; SATIMO certified

Danbury, Connecticut, US

Design, fabrication, and testing of antennas including metal stamped or flex multiband PIFA, GPS, WLANAntenna anechoic chamber measurements; SATIMO certified

B.A.Sc., Electrical Engineering

M.A.Sc., Electrical Engineering, Masters In Electromagnetics