● High Performance Analog, Infrastructure & WiFi Team● Designs supported: 3.4-3.8G 8W Doherty PA Module with novel thermal management;3.4-4G 10W Doherty PA Module with 500MHz DPD BW; 2W FEM WiFi PA inHBT/GaN/Laminate with novel Doherty structure and integrated thermal tracking● Developed RF + Electrothermal design flow for FEMs in HBT/GaN/Laminate● Full 3D EM design flow in FEM/HFSS: unified simulation of laminate, packaging, bondwires, SMDs, IPDs, ICs with mixed HBT/GaN/Laminate technologies● Developed behavioral model flow using extracted modulated model data and polynomialfitting that enabled fast analysis of FEM performance at the system level using Simulink● Created automated measurement data extraction scripts in Matlab, AEL, and Unix shell

● Created reference designs and flows across multiple advanced technology nodes (FDSOI,FinFET) showcasing technology capabilities at the block level (PA, LNA, Switch)● Designed a 6GHz WiFi stacked differential PA with record FDSOI Psat 28dBm hitting allcritical EVM linearity targets for 802.11ax using 22nm 22FDX● Designed a 28GHz LNA with record 1.4dB noise figure, 28dB gain in 12nm FinFET (12LP)● RF Module FEM design: PA and Switch (22FDX) with LNA (12LP) integrated into a FrontEnd Module (FEM) using Virtuoso RF SiP tool. Silicon interposer; BGA; laminate● Developed an automated design tool in Skill, Matlab, Python that instantiates parametricdevices and modifies CDF, including layout/LVS/PEX, with automatic data post-processing● Developed a new design automation tool that migrates/ports designs across nodesautomatically, including schematic, device sizing, simulation, layout, PEX, and LVS● Developed an improved fill methodology that reduced RF passive loss up to 40%● Managed relationships with all major electromagnetic tool EDA vendors (EMX, Keysight,Ansys, etc), including new electromagnetic tool validation scripts in Matlab, Python

● Principal developer of new RFIC technology platform, responsible for development andplatform integration, including passives, active cells, and PDK creation● Design of high-power multistage high-gain (>30dB), wideband (1.8-2.2GHz) RFIC leadproducts in LD10 platform with first-pass success: PTMC21040 2x20; PTMC21060 2x30Wsymmetric; PTMC21061 20W+40W asymmetric (Doherty); PTMC21080 2x40W● GaN product design and optimization for 5G, including 3.5GHz and 4.5GHz multi-stage GaNMMIC designs using GaN PDK (Cree, Wolfspeed)● Design of parts across multiple technology platforms: LD9/LD9LF/LD50/LD10/LD11/LD12● Development of new LDMOS technology platforms from the beginning including all aspectsof process, design flow, PDK, and qualification (LD10IC, LDH1IC 50V)● Development of IC process passives, including the LD12IC high-Q IPD platform● Packaging, assembly, die and wire bond design using 2D, 3D electromagnetic simulationtools, capturing parasitic effects and coupling for multiple packaging options (QFN, MCM)● Large signal modeling, harmonic balance, stability, and electromagnetic analysis (ADS,Momentum, EMPRO, HFSS); layout, LVS, DRC; die option and wire bond planning; DOEstrategies; pizza mask; staging wafers; corner lots; load pull evaluation and optimizationmethodology; tuning/optimization; production testing and yield● Created automated Matlab scripts to process RF measurement data, extract criticalparameters, and summarize performance into Powerpoint and Excel documents● Established new methodologies to decrease design cycle time and maximized design reuse● Interfaced with Test Engineering in defining tests and limits for product qualification, yieldimprovements and test time reduction on the ICs● Collaborated with Applications Team and customers to understand line-up requirements andtranslate them into technical specifications for the IC development teams; portfolio planning

● Complete RFIC design cycle experience of power amplifiers● Design specification/targets compliance doc and simulation (ADS, Momentum, HFSS)● Process Design Kit, S-parameters, large signal modeling, harmonic balance, stability● Layout (die/reticle); DRC, LVS; thermal tracking circuits; ESD placement● Packaging, die and wire bond; die option and DOE strategies● Electromagnetic simulation, optimization, extraction of IC process passives and packageparastics using electromagnetic tools (HFSS, Momentum)● Power amplifier tuning and load pull design methodology; design tuning/optimization andperformance trade-offs; characterization, production testing, and yield● Successfully designed a best-in-class Class F 47W, 800MHz IC with internal matching andharmonic tuning for target GSM/EDGE applications (MRFE6S8046)● Successfully designed a 140W, 2GHz ceramic (air-cavity) device for target WCDMADoherty applications (MRF8S21140, HV8 platform)● Doherty design, implementation, tuning, and DPD correction● Design of industry leading power amplifiers in major operating bands

● Complete antenna design cycle responsibility, including full RF CAD simulation usingAnsoft HFSS and XFDTD (bandwidth, efficiency, radiation pattern, diversity, SAR)● Antenna design and placement for optimal bandwidth, efficiency, SAR; IFA, PIFA, FJA,designs; diversity antenna; antenna tuning and optimization of PCB matching networks● Prototype fabrication and measurement: S-parameters, efficiency, radiation pattern, TRP, TIS● Design of complete multi antenna solutions: stamped, flex, multiband PIFA, GPS, WLAN● Antenna anechoic chamber measurements; SATIMO certified

Design, fabrication, and testing of antennas including metal stamped or flex multiband PIFA, GPS, WLANAntenna anechoic chamber measurements; SATIMO certified