As the CTO of Chipletz, Michael's responsibilities include overseeing research and development efforts, charting the technical roadmap, and leading product advancement initiatives. He actively collaborates and innovates with advanced material suppliers, equipment suppliers, passive device makers, and state-of-the-art manufacturing to enhance Chipletz's position in the market and contribute to the company's ability to deliver cutting-edge semiconductor solutions. Before co-founding Chipletz, Michael spent two decades at AMD, where he not only led the development of virtually all of AMD's packaging solutions but also played a pivotal role in introducing the latest industry-revolutionizing AI packaging platform.
Listed skills include Semiconductors, Silicon, Reliability, Asic, and 14 others.