I am in charge of Quality and Reliability Division in ChipMos Technologies in Shanghai from Y2016 to now. We are under preparation of Qualification and LVM of NAND Flash related products like eMMC and Raw NAND BGA. We have also performed package assembly and testing process for other memory(DRAM and SRAM and Nor Flash) now. Built up technical training programs including MSA, DOE, FMEA, SPC, PCN/CCB, ESD, 6S, Auditor Skill, ..., etc. I worked in Sandisk Taiwan from May,Y2004 to Feb, Y2016 as at site manufacturing quality managers at both Taiwan and ShenZhen from Oct,2009 and responsible for quality management of all subcontractors and key material suppliers built in Taiwan, Korea and south of China including Substrate, PCB, Lidset, Housing, Connector, passive components, IC Package Assembly & Testing houses, SMT/EMS house for USB, CF & SSD product. While I was working in Shenzhen from Y2009, I will also be responsible for Sandisk ODM products except SMT based products like USB, CF and SSD. I was transferred to Sandisk Malayia as senior quality manger who lead SQE, Quality Management System and MFG In-Proess Quality Engineering team from July,2015 to Feb.’2016. Before joining Sandisk, I had been working in one of largest ChipSet/Peripheral IC Design houses; ALi Corporation as Quality Engineering manager who managed all IC RMA/FA, marking spec, IC packaging spec, IC package assembly and testing house and critical material suppliers built in Taiwan and China. I had been working in OSE, one of IC Package and Testing House in Taiwan, as Quality Department manager to manage IC Package Assembly Materia, Assembly Process Control, IC Testing Process, Quality Management System, Statistical ProcessControl and Customer Quality Engineering for 6 years(1995-2001).
Listed skills include Spc, Six Sigma, Design Of Experiments, Lean Manufacturing, and 28 others.
