Michael Watson Email & Phone Number

Philadelphia, Pa, Us

Morrisville, Pa, Us

Gelest, Inc. continues to benefit from the investment in our capabilities as part of the Mitsubishi Chemical Group. Gelest is a global supplier of silanes, siloxane polymers, metal organic compounds, acrylate monomers, formulated silicone products, and treated microparticles. This role involves leadership of the formulated silicone products R&D group, the technical service group, and the microparticle treatment R&D group. The commercialization of desired products also requires our groups to perform process development of the formulated silicone and treated microparticle products to scale from grams to metric tons. Finally, cross-functional collaboration is necessary to be able to work with customers and provide products through a stage-gate process for the Electronics, Automotive, Aerospace, Energy, Healthcare, and Microelectronics markets.

Oslo, No

Global R&D Adhesion Incubator Leader for adhesion technology and electronics materials development expert. Trained product development personnel, introduced sales experts to new product technology, and maintained close communications with Marketing, Manufacturing, and Supply Chain functional groups.

Shanghai, Shanghai, Cn

Silicone product and technology development for applications requiring specialty silicones. Products and technology developed for electronics, construction, automotive, aerospace, defense, microelectronics, and healthcare market segments. Development included sealants, elastomers, LSR, adhesives, hotmelts, coatings, primers, and HCR products. Most development activities included some adhesion issue which allowed from the broad depth of product type development in many market segments.

Falls Church, Va, Us

Developed, specified, and insured performance of materials for use in airborne electronic and infrared countermeasures devices. My work centered mostly around developing and specifying new materials for use in extreme environments and with high voltage. Transformer coil impregnation, electronic encapsulation, adhesives, printed circuit boards, and thermally conductive heat dissipation materials were among the areas work was performed.