• Cross-functional work with engineering and marketing teams to support field and customer application issues for MCU devices. • Development of technical solutions to field organization and customers. Use of UltraFLEXplus test system to debug, evaluate and disposition issues and defects.

• Develop applications and test military and aeronautics sensitive software and hardware for quality assurance. • Develop in-house application software using Visual Studio for integrating test suites. • Apply Agile project management practices. • Engage hardware design team to generate regression test plan and document processes to meet compliance. • Test system application software, instrument drivers and firmware for hardware products. • Build and load custom computer images for testing. • Experience with VXI, PXI and Teradyne Hardware: Di-Series, Ai-Series, Bi-Series and Spectrum.• Experience with Bart PE, Symantec Ghost, Team Foundation Server, ATLAS language and third party drivers – Racal, Keithley, Agilent, Ascor, Textronix and National Instruments. • Experience with MIL-STD-1553 and ARINC 429.

• Developed application software in Visual Studio 2005 using Visual Basic with .NET. • Presented technical papers through formal international conferences and on-line seminars. • Developed and debugged production and characterization programs on mixed-signal ASIC devices and the respective PCB hardware. • Applied project management practices and led each assignment to completion. • Performed circuit analysis to troubleshoot application hardware. • Tested integrated circuit DFT methodologies SCAN, JTAG and BIST. • Engaged design team to generate collaborative test plans and resolve device issues. • Supported reliability engineering to resolve ESD, HALT and HAST failures. • Sustained ICT in debugging functional ASIC component issues on system circuit boards. • Global Team Leader of EDA conversion tools. • Developed training material and instructed globally for EDA translation software. • Documented applications, characterization reports and processes. Senior engineer on several ASIC and application projects. • Mentored new hires and interns through on the job and informal classroom training. • EDA experience with WGL, STIL and VCD files. • ATE experience with Catalyst, A580, J750, FLEX, UltraFLEX and J973 testers.

• Developed, integrated and debugged digital wafer sort and final test solutions. • Diagnosed defect induced yield loss and manufacturability problems and implemented yield enhancement solutions. • Implemented quality program improvements to increase manufacturing throughput. • Supported offshore design, assembly and final test. • Mentored new hires through on the job and informal classroom training. • ATE experience with LTX Trillium, Delta STE testers and Electroglas probers. • Operated and debugged tools for wafer FAB manufacturing, management and senior engineering. • Sustained diffusion and implant work cell tools using SPC methodology. • Process tool experience with Semitool VTP-1500, KBTI Apogee vertical furnaces, Eaton implanters and Asyst wafer pod robots. • Metrology tool experience with SDI-3030, Tencor 6220, AIT, TUV1270 and TUV1070.

• Ran system diagnostics and troubleshot errors to root cause at board and module level. • Supervised technicians, escalated critical path issues and documented open issues for management reports. • System testing in environmental rooms ranging from 5 to 45 degrees Celsius. • Mentored new hires through formal classroom and hands on training.

• Tested, analyzed and debugged final system functional tests on mixed-signal circuit cards in multiple environmental conditions for customer acceptance