People leader. Responsible for the QMS, EMS and H&SMS ensuring compliance, managing changing requirements and initiating ISO objectives, while developing E2E capabilities and ensuring cross company engagement.Leading Quality team responsible for incoming quality control, inspection, calibration, internal non-conformance resolution, complaints, audit program, claims and returns analysis and new product APQP/PPAP.Supporting customer audits, creating E2E customer quality engagement and putting customers first.Building partnerships with key suppliers by developing our Supplier Quality Management system, hiring key SQM skills and delivering new Supplier Improvement Program and audit schedule.

Operations leader for the TCE&Q Storage team, managing daily operations and communications, controlling budget and delivering yearly strategy, headcount and budget planning.Also Warranty Program manager, responsible for Storage business warranty cost analytics and governance.50% of role as Customer Escalation focal point for major Storage product issues in China, utilising New H3C relationship to confirm local problem, manage external communications, determine impact and deliver costed resolution plans:- Developed Storage Warranty and COPQ reporting, monthly review and analysis, identifying new insights and driving corrective actions. Incorrect order BOM findings led to updates in Configurator tool improving Nimble case volume by 15%- Coordinated HPE’s response to significant fiber optic issues at major Banking and Government customers in China. China was first observer of issue. Engaged with engineering and procurement to return optics for FA and RCA. Weekly calls with partner H3C, logged incident data in repository to identify trends. Secured 7900 free parts from suppliers as swap stock. Created HPE signed Quality letter for customers. Worked with H3C to confirm customers eligible for swap. Focal point for subsequent WW plan, securing more optics, documenting L3 engineers test and replace process and public knowledge document.- Led initiative to improve customer experience on HPE Synergy. Built team, managed stakeholder relationships, identified UX pain points and applied User Centered Design techniques, which led to new Firmware Management interface proof of concept design for next release.- Supported Voice of Customer product related surveys by producing Storage portfolio questions from Product Management engagement and generating top drivers for NPS improvement program

Managed global team of 8 people responsible for Customer Experience & Quality improvements, warranty spend and actionable insights on Data Center Networking switches throughout product lifecycle.Responsible for customer issue management, global field action planning, NPI quality needs, public software & licensing portal admin, QBR quality input and FA lab.Delivered performance reviews, managed rewards and recognition, managed restructuring and workforce reductions. Managed budget and strategic initiative planning. Built development and coaching plans:- Reduced Software Outages by 69% YoY, by driving Software Quality initiative. Utilised outage data to garner insights on customers, product, age of software and defect types. Delivered updated warranty policies, public documents and support training based on SW maintenance best practice. Produced a customer searchable Defect Search Tool and new defects bulletin. Produced Customer Found Defect trends to drive test and development improvements. Managed change, delivered training to support teams and new process operating instructions;- Achieved QuEST Forum TL9000 Certification: 92 additional telecoms requirements over ISO9001:2008 and monthly submission of new failure data for industry benchmarking;- Instituted Beta product teardown of SMB products in our FA lab. Prevented release of performance and safety issues;- Managed DC Networking $4M warranty cost elements, quarterly review and determined improvement plans using KPIs and data analysis, achieving $250K/qtr saving;- Improved customer satisfaction by 12pts Y/Y for Networking Software & License portal, by delivering customer survey, determining gaps and defining agile webpage development and branding program;- Volunteered as employee lead for site closure, leading management of change and liaising with country team.

Responsible for Product KPI adherence to design and warranty targets, within Networking TCE&Q org. Responsible for WW product hardware elevation/escalation issue management and CLCA with China OEMs. Supported quarterly Quality and Business scorecard reviews:- Identified and managed 41 product issues, utilising Lean Six Sigma tools, 8D and DMAIC process, delivering $15M in future warranty cost savings. Managed cross-functional teams and WW Recall programs, delivered 8D reports to major customers, ensuring successful issue resolution for many Fortune 500 companies.- Program managed the migration of the 3Com Product Quality Reporting system into HP equivalent Product Quality System. Created requirements specification, sourced new datasets, UAT tested models and specified new time based reliability measures (MTBF). - Developed and introduced post-CLCA monitoring tool in Product Quality system to verify effectiveness of fixes and to allow reporting of warranty Cost Avoidance. Introduced COPQ reference costs;- Managed program with Global Parts Delivery team to capture product identification at receipt in regional RMA logistic hubs, to reduce Fraud and introduce accurate Time to Failure measure;- Managed Weekly Quality Forum with pan-HP teams, reviewed KPIs of 1005 skus and installs of 4M units. Achieved key stake holder buy-in and support commitment. Focused on action setting from insights generated;- Program managed Support Case Volume reduction project as part of strategic initiative. Utilised DMAIC model and PM skills to identify 10 sub-streams, which implemented the following key improvements: “OneTouch” automated RMA request for legacy skus; Trade-In program for legacy skus; Legacy customer qualified leads program; Warranty Entitlement for Original-User only; Known issue remediation planning.

Sole responsibility for management and reporting of Product/Component lifecycle quality within Supply Chain, covering 350 Networking skus. Produced KPIs and delivered monthly quality reports to Product Management. Specification of APQP and Quality Standards/Plans for R&D, sub-contractors and OEMs:- $25M tangible decrease in lifetime warranty cost through identification and management of 26 product quality issues using Six Sigma techniques. Managed WW SWAT teams and Recall programs. Produced 8D reports. Implemented Corrective Actions, verified fixes and implemented changes in NPI process;- Regular visits to China and Taiwan OEM facilities, to develop in-house quality reporting, data analysis and return to vendor program. Developed and managed weekly quality action meetings with both OEMs;- Developed program to review New Product performance in the 12months after launch, in manufacturing and the installed base. Captured defective units for FA & CLCA. Developed new release gate process to move product into sustaining.- Project managed the development of a new global Product Quality Data analytics tool “QUINCEY”, to replace intensive manual processes, within budgetary and timescale constraints, with external developers. Allowed Quality community to proactively review product/divisional field performance in seconds, rather than weeks;- Project managed the creation of Return to Vendor system for defective parts to be shipped to suppliers for RCA and CAPA, with automated defective part $ cost recovery of $40K back to 3Com when failure confirmed;- Created a forum for all technical functions to review KPIs and present product issues to R&D.

Mechanical Design liaison between manufacturing and R&D. Input to Concept designs for DFM. Sign-off for all mechanical parts during NPI and sustaining through PPAP. Supporting PMQA and buyers with verification builds. Prime contact on handset assembly quality/yield issues relating to mechanical parts or processes.- Sourced Parts Inspection system to reduce PPAP verification time by 50% and fix assembly and cosmetic issues;- Resolved cosmetic "fit" issues on phone flip mechanism, through tolerance chain analysis and inspection versus specification drawing. Assembly process workaround and tooling dimension change applied to next gen.SMT Weekend Shift Process Engineer for first 8 months.

Supported High Volume Thin Film leaded resistor manufacture and production of Hybrid circuits for TV's. Implemented process and yield improvements to reduce resistor scrap from 10% to 2%, using SPC, pareto and Six Sigma tools. Commissioned new equipment, developed jigs/fixtures, monitored IPQC using SPC.