Mike Gronseth Email & Phone Number

Minneapolis, MN, US

Bloomington, Minnesota, United States

Bloomington, MN

Forecasted mechanical improvements to the drive design team and managed readiness for product team transfer. Assumed early program management responsibilities.

Bloomington, MN

-Managed all aspects of HAMR (Heat Assisted Magnetic Recording) laser development with an outside vendor. Worked all interactions with mechanical and electrical design, factory process, reliability, materials, and supplier quality within Seagate. Managed yearly multi-million USD SOW projects. Quarterly Asia travel.

Bloomington, MN

-Worked with mechanical and electrical design, process, test, and drive customers to establish a HAMR process for HGA (Head - Gimbal Assembly) delivery with acceptable quality and quantity.-Led process development and factory build planning, and provided executive level communication of issues, plans, and outlook. Worked with an outside vendor to establish.

Bloomington, MN

-Cross-functional team leadership of all areas from wafer process through drive customer qualification including wafer density proposal, executive approval, kick-off and development.-Negotiated complicated trade-offs between groups based on modeling, experiments, and cost.

Bloomington, MN

-Coordinated cross-functional department projects, build planning, factory allocation, and reviews to meet product team hand-off goals. Initiated lean projects for reduced time to learning.

Bloomington, MN

-Managed a small team to support transducer development teams and tribology system teams in all mechanical needs. Implemented Seagate-wide configuration management strategy for spin-stand testing, reducing configurations, increasing time-to-data, and saving capital and floor space.-Oversaw development of leading edge technology and major cross-functional.

Bloomington, MN

-Provided main HGA contact for internal mobile and desktop drive customers as well as overall internal HGA contact for numerous projects. Evaluated emerging mechanical and electrical wafer, slider, suspension, and HGA technologies and documented configuration and test requirements.-Project lead for suspension new product development, focal point for.

Process Engineer Intern during ramp of head suspension productAnalyzed process capability, organized and ran numerous metal forming and static attitude tests.Managed tooling design/build/debug and investigated impact of customer design changes.