Mike Stam is a Senior device modeling engineer at Boeing. He possess expertise in simulation, device characterization, device physics, rf, cmos and 25 more skills. Colleagues describe him as "I have worked with Mike at IBM for about 5 years and at Globalfoundries for 3 years. He has a very good working knowledge in all aspects of FET modeling and was a key engineer in many of our advanced planar and finfet projects. For the last few years, Mike worked with me on our 10nm and 7nm models, including FET amd SRAM DC fitting and mismatch characterization. He was also the team interface with our modeling tool vendor and helped advance the tool capabilities. As a member of a muti-site team, Mike worked independently and communicated his results very effectively with the team. I enjoyed working with Mike and valued his diverse expertise." and "I worked with Mike since I was hired into IBM 9 years ago in the field of device characterization and compact modeling. Mike and I collaborated on many projects during the technology development of the 32nm, 22nm, 14nm, and 7nm node. Our most recent collaboration was centered around the customization of the Keysight MBP software for extraction of CMOS compact models, which benefitted greatly from Mike’s experience with ICCAP customization for IBM. Mike managed part of the MBP new release interaction with Keysight and was the local reference for model engineering questions. I enjoyed very much working with Mike and I highly recommend him for his next position."