Mike Stapleton Email & Phone Number

Senior Component Engineer responsible for component and supplier qualification of RF ASIC, III-V Photonic PMZ, FCD, Semiconductor (Timing , Linear, Logic, Transistor, Diodes), LED's and Inductors.Responsible for co-ordinating and leading supplier audits of top RF GaAs pHEMT, InP HBT, InP Photonics and BiCMOS wafer foundries.Responsible for co-ordinating and leading supplier audits of top ASIC custom and Standard BGA packaging assembly houses globally.Responsible for co-ordinating and driving to root cause complex F/A activity with design, EMS and suppliers.Responsible for life cycle management of components including coding, qualification, PCN processing, second sourcing, RoHS, Reach and Conflict Minerals.Responsible for development of procurement specifications for RF ASIC, FCD and Integrated Circuits

Manager of Semiconductor and Passive Component Engineering

Successfully managed a component portfolio including coding, qualification, PCN ,ROHS, Conflict Minerals and failure analysis support.Lead auditor of industry leading GaAs, Silicon foundries and packaging suppliers.Develop procurement specifications for custom RF ASICsDrove numerous failure analysis activities on RF ASIC amplifiers, Si ASIC's, Linear IC's, FCD (OCXO, TCXO, VCXO, etc..)Drove numerous process technology issues with leading GaAs and Silicon foundries.Supported design, GCM's and EMS's on second sourcing activities for security of supply de-risking and cost reductions.Developed audit checklists for process technology and packaging audits.Developed a supplier approval and audit process

Designed military electronic support measures receivers for S, C, X, Ku, K, and Ka bands.Developed test H/W and S/W for an automated test suite to perform first article testing on Electronic Support Measures and Electronic Counter Measures Systems.