Mike Ahrens Email & Phone Number

San Luis Obispo, Ca, Us

Santa Barbara, Ca, Us

Advanced DevelopmentTransducer Suspension TechnologyIP CreationEngineering Management of Global Team

Cupertino, California, Us

Special Projects Group (SPG)Sensors and Compute SystemsComplex System-Level DesignNPI Production Line Setup in EuropeRapid Prototyping - Numerous MethodsHuman-Machine Interface (HMI) ControlsVehicle Interior Conceptualization

Ride.Open.Enjoy.The WiseCracker Bottle Opener easily mounts to any bicycle frame! Our products can be customized to include team, shop or special event graphics. Manufactured from various materials including aluminum, stainless steel and titanium, each version is lightweight and simple to operate. The WiseCracker product line is 100% produced in the USA using only the finest materials, processes and finishes. Invented in 2006 and spun off into its own company in 2014, the product line has sold into over 30 countries worldwide and all 50 United States.

Campbell, Ca, Us

Chargepoint provides charging stations, mobile apps and the network to enable electric vehicle charging. I was responsible for hardware development related to charging stations - specifically electro-mechanical packaging with a keen focus on user experience.

Santa Clara, California, Us

January 2015 - January 2017: Client Computing Group• Responsible for the design and execution of mechanical concepts, analysis and evaluation in support of Intel's consumer electronics platforms including phones, tablets and mobile devices• Develop novel thermal solutions for high-power mobile devices and docking systems• Develop hinge mechanisms to support both rigid and flexible display technology• Utilize in-house rapid prototyping tools to speed time to market for new designs• Manage domestic supply chain to support prototyping efforts for new product development• Mentor junior engineers and interns by serving as a role model for cohesive, cross-functional teamworkAugust 2013 - December 2014: Silicon Photonics R&D• Responsible for enabling high-volume manufacture for Silicon Photonics transceiver modules• Design specialized tooling to support lens metrology (Sub 5 micron tolerance range), first-article inspection, new product introduction (NPI) and high-volume ramp• Serve as interim engineering manager when direct manager travels overseas• Spearhead new manufacturing processes to to meet customer sampling delivery schedule • Enable overseas high-volume manufacturing effort through bill-of-materials (BOM) ownership, complete documentation and video-based work instructions

East Aurora, Ny, Us

• Interacted directly with end customers to develop robust 'smart motors' used in harsh environments • Many designs met or exceeded IP65/IP67 requirements while retaining a low bill-of-materials cost and high profit margin• Responsibilities included PC board outline definition, die-casting design, specialized tooling and hands-on manufacturing support• Mentor junior engineers

Waltham, Ma, Us

• Responsible for developing world class scientific instruments in the mass spectrometry field• Responsible for ion trap mechanical design for Thermo Fisher's award-winning LTQ Velos mass spectrometer instrument• Developed electrical feed-through devices using plastic injection molding, insert molding used in vacuum environment• Created and maintained large 3D CAD assemblies, detailed drawings and associated bill-of-materials (BOM) documentation using SolidWorks and Pro/Engineer CAD platforms• Initiate design reviews to present new concepts to upper-level management and cross-functional team members from Purchasing and Manufacturing• Mentor junior engineers

Santa Clara, California, Us

January 2005 - December 2006: Processor Burn-In Lab• Responsible engineer for test equipment valued at $3M including two burn-in chambers, robotic automation tooling and ancillary equipment• Validated new burn-in test conditions/test programs to qualify Intel's Xeon server products prior to mass production• Developed ergonomic tooling for burn-in lab including lifts, trolleys, burn-in board handlers and burn-in socket actuators• Managed burn-in chamber suppliers to optimize system performance across electrical, thermal and mechanical platformsJanuary 2003 - December 2004: Fiber Optic R&D• Responsible for fiber-optic transceiver product design in the XFP Form Factor• Developed low-volume, high-accuracy assembly stations for tunable laser products• Awarded (3) patents pertaining the XFP Form Factor transceiver mechanics

• Responsible for the mechanical development of fiber-optic transceivers in the SFP Form Factor• Developed plastic injection-molded housings for both short-reach and long-reach product applications• Worked directly with key customers (Cisco, JDS Uniphase, McData) to optimize SFP release mechanism design• Created process assembly instructions and custom tooling for new product introduction• Maintained detailed BOM lists, tracked cost of goods sold and managed diverse supply chain• Awarded (3) patents pertaining to SFP Form Factor transceiver mechanics

• Interface directly with customers to define project scope, deliverables, budget and timeline• Responsible for the design of high and low volume machined parts for the telecommunication, medical and semiconductor industries• Created 3D models and 2D drawings using Pro/Engineer CAD software• Prototyped concepts as needed

• Served as a technical interface between satellite design engineers and machine shop personnel; promoting DFM/DFA techniques• Communicated with outside vendors, purchasing, and quality teams to ensure proper manufacturing standards were satisfied• Reviewed 3D CAD models and provided feedback to design engineers prior to fabrication• Optimized heat treating process for 2024 aluminum billet-machined parts• Qualified and managed local supply chain for precision CNC machining and finishing

Bachelor Of Science, Mechanical Engineering

High School Diploma