Mike Macgregor work email
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Mike Macgregor personal email
A lead design engineer with 26 years of experience in the high tech industry. Experienced product development as well as team leadership through:• Imaginative and new concept and technology development as well as creative problem solving • Collaboration in cross-functional teams• Strong ability to capture, translate and communicate design and process requirements • Expert and resourceful design and execution of tests and experiments to demonstrate the relationships between materials, process and design performanceSpecial skills in the areas of: • Test & experiment design for structural and thermal characterization• Mapping data & analysis to customer quality and reliability requirements specifically in the areas of shock, vibration, temperature cycling and bake• Structural analysis for risk assessment of fragile system components in shock• Data collection and analysis including statistical analysis of data• Program management and technical team leadership
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Thermal Design EngineerFourth Power Feb 2024 - PresentCambridge , Ma, UsDesign, analyze and optimize critical technology capable of conveying pressurized molten tin at temperatures from 230 to 2400 oC for utility customer’s energy storage needs. -
Sr. Staff Mechanical Design EngineerChargepoint May 2023 - Feb 2024Campbell, Ca, UsLed development and test of critical liquid cooling technology for fast charging technology. -
Sr. Mechanical & Systems EngineerAmazon Mar 2022 - May 2023Seattle, Wa, UsLast MileElectric Vehicle Charging Infrastructure Products -
Sr. Mechanical EngineerAmazon Jan 2020 - Mar 2022Seattle, Wa, UsLast MileIn-Vehicle Edge Compute HW Development
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Sr. Mechanical EngineerAmazon Nov 2018 - Jan 2020Seattle, Wa, UsAmazon GoBespoke Camera and Mounting HW Development
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Senior Mechanical Engineer - Design For Quality, Reliability, Structural, Thermal, Cost & Mfg.Amazon Web Services Aug 2015 - Nov 2018Seattle, Wa, UsLeading mechanical design and specification of electrical equipment including Automatic Transfer Switches for large scale critical infrastructure in datacenters. Responsible for the creation of technical specifications and requirements as well as validation of mechanical design elements. Utilizing failure analysis, predictive analysis such as FEA and CFD as well as experimental testing to develop new products in next-generation data centers. Played a key role in the architecture and development of the rack-level UPS announced by AWS VP Peter DeSantis in December of 2020 at re:invent. -
Senior Mechanical Engineer - Design For Quality, Reliability, Structural, Thermal, Cost & Mfg.Intel Corporation Jun 2003 - Aug 2015Santa Clara, California, UsDesign and develop thermal mechanical enabling platforms for desktop PC, graphics cards, servers and test equipment. Solutions take the form of CPU socket designs, heat sink and retention designs as well as complete validation in quality and reliability based on use conditions. 4 years of design development on first-ever High Density Modular Tester with liquid cooled test instruments. 3 years of design development on high-volume, 200 watt thermal dissipation graphics cards including blower, heat sink, thermal interface material and structural retention design. 5 years of design development and structural analysis of high-volume high-power CPU & chipset heat sink and retention designs with special focus on structural design mitigation for shock failure. Responsibilities include: supervising the work of fellow engineers, technical peer review, product risk assessment, application of structured technical problem solving. -
Quality & Reliability Engineer - Validation Of High Density Electronic Platform Shock & ThermalsIntel Corporation Nov 2001 - Jun 2003Santa Clara, California, UsValidated thermal mechanical enabling platforms against Intel and industry quality and reliability requirements. Developed use conditions-based validation requirements and phased-out legacy-based requirements for desktop PC platform enabling heat sinks and retention mechanisms. Focus on solder joint reliability under temperature cycling and shock use conditions as well Monte Carlo analysis of complex environmental distributions. Responsibilities included: definition of quality and reliability stress requirements, accelerated degradation modeling and application of structured technical problem solving.
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Mechanical Engineer - Consumer Electronics & Desktop Platform DesignIntel Corporation Mar 1998 - Nov 2001Santa Clara, California, UsDesign and develop thermal mechanical enabling platforms for desktop PC and youth consumer PC peripheral products. Solutions take the form of PC heat sink and retention designs as well as consumer youth hand-held video camera and consumer youth light show machine. Designed first-ever injection molded plastic heat sink retention clip. Designed and specified cosmetic-grade injection-molded plastic parts for camera and light machine housings working side-by-side with industrial designers.
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Systems Manufacturing Engineer - Process Design For Quality Product Assembly & TestIntel Corporation Mar 1996 - Mar 1998Santa Clara, California, UsSystem factory process engineer. Delivered assembly, test & packaging process for Server products including: chassis, bezel, mother-board, power supplies, peripheral bays through product introduction, launch and sustaining. Responsibilities included: driving continuous improvement in processes, materials and design using factory yield data, developing tooling and fixtures to reduce incidence of cosmetic defects and improve beat-rate and the training of manufacturing and productions technicians.
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Mechanical Engineering InternIdeo Design Consultancy Aug 1995 - Dec 1995San Francisco, California, UsResponsibilities include acting as liasison between engineering and prototyping groups, design, machining, assembling and debugging of mechanical assemblies and product concepts. Extensive work with 3-axis CNC milling machines, tool path programming, development of high precision fixtures and extensive work with prototype engineering materials.
Mike Macgregor Skills
Mike Macgregor Education Details
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Stanford UniversityMechanical Engineering -
Portland State UniversityMechanical Engineering
Frequently Asked Questions about Mike Macgregor
What company does Mike Macgregor work for?
Mike Macgregor works for Fourth Power
What is Mike Macgregor's role at the current company?
Mike Macgregor's current role is Sr. Mechanical Engineer.
What is Mike Macgregor's email address?
Mike Macgregor's email address is mm****@****zon.com
What schools did Mike Macgregor attend?
Mike Macgregor attended Stanford University, Portland State University.
What skills is Mike Macgregor known for?
Mike Macgregor has skills like Engineering, Manufacturing, Semiconductors, Design Of Experiments, Design For Manufacturing, Engineering Management, Testing, Failure Analysis, Finite Element Analysis, Heat Transfer, Cross Functional Team Leadership, Simulations.
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