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Solid technical experience in Product Engineering and Quality for mixed-signal, analog, digital, and memory IC products using CMOS, Bi-CMOS, and bipolar processes. Results-oriented experience supported by a strong technical and managerial background including: -New Product Introduction -Engineering Project Management -Product Cost Reduction -Yield Enhancement -Cross-functional team leader -Customer Problem Resolution (8D) -Statistical Process Control (SPC) -Automotive requirements -Characterization -Data Analysis -Process & Package Qualification -Process & Fab Transfers -Engineering Cycle Time reduction -Assembly & Test Transfers -Quality Review Board (QRB) 15+ yrs -Supplier Management Team -M&A IntegrationDrove New Product Introduction and Cost Reduction, created departmental and project budgets, and led cross-functional teams. Set strategies for organizing, structuring, training, and motivating engineering organizations. Directed offshore engineering teams, and worked with multiple wafer fabs and assembly/test vendors located throughout the world. Integrated product lines and product development processes from 5 M&A's. Coordinated projects on dozens of new/revised products at a time.Over 25 years of semiconductor engineering experience in Product, Test, QA, FA, and Reliability for Fairchild Semiconductor, Sierra Semiconductor, National Semiconductor, Exar Corp, and ST Microelectronics.
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Customer Quality Engineering ManagerStmicroelectronics Oct 2013 - Mar 2023Geneva, Switzerland, ChQuality Engineering account management for Apple. -
Account Operations ManagementEsilicon 2012 - 2013San Jose, Ca, Us• Drive Profit/Loss improvement for customer accounts.• Manage key customer programs; serve as primary interface between internal teams and the customers to resolve all technical and logistical issues.• Assist in bringing new suppliers into the approved supply chain.• Implement key customer strategic initiatives.• Drive cost reduction with supply chain and engineering -
Sr. Director, Product & Test Engineering, Operations OrganizationExar Corporation 1996 - 2012Fremont, Ca, UsGuiding the company's Product and Test Engineering groups; leading up to 39 employees in California and Malaysia in new product introduction, and sustaining of all Exar semiconductor products.Strategize on how to organize, structure, train & develop, and motivate the Product & Test Engineering organization.Determine talents and skills needed by the department, assess talents and skills available, and make adjustments to make the department and company successful.Provide support and carry out activities that ensure manufacturability, reliability, quality, and cost effectiveness of analog, digital, and mixed-signal semiconductor products. Work with Design, Marketing, Packaging, QA/Reliability, Production Control, Operations/Manufacturing, and Accounting organizations to achieve these goals. Lead six Product and Test Engineering groups that are responsible for test development, characterization, product evaluation and qualification, documentation, yield improvement and cost reduction, and problem solving for all semiconductor products in development and in production. The organization drives efforts to get products released to production, as well as improving and sustaining products in production.Product types handled include: Power Management, Digital Power, Serial Interface, Interface, UART, SONET, Telecom, Datacom, LIU, and clock products; products are from CMOS, bipolar, and bi-CMOS processes. -
Product Engineering DirectorExar Corporation Aug 1996 - Jan 2009Fremont, Ca, UsManage an engineering group in charge of releasing new analog, digital, and mixed-signal products to production. Work performed in the group includes evaluating, characterizing, coordinating reliability qualification, debugging, and testing products. Program Management of new product introduction, schedule creation and tracking, and cost analysis of products. Once in production, sustaining efforts include cost reduction, yield improvement, test time reduction, quality improvement, and failure analysis.
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Sr. Manager, Product Enginering, Qa, Reliability, Failure AnalysisNational Semiconductor 1988 - 1996Held multiple positions in Telecom group, and EEPROM group.Managed Telecom Product Engineering team responsible for CODEC/Filter COMBO products, Modems, SLIC, and Subscriber Line Interface Module (SLIM, a module composed of 5 IC's mounted on a thick film ceramic substrate; IC's were bipolar, CMOS, and laser trimmed thin film.)Managed EEPROM Product Engineering, QA, FA, and Reliability Group. The group performed Reliability Qualification, Customer Returns analysis and debug, and implemented improvements through mask revisions, test improvement, and procedural improvements to achieve AOQL improvements. Qualified the EEPROM group for Ford Motor's very stringent Q1 program. Implemented use of FMEA, Control Plans, and SPC, as expected by automotive customers' QS9000 spec (now TS-16949). -
Sr. Product EngineerSierra Semiconductor 1987 - 1988
Mike Stoops Skills
Mike Stoops Education Details
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University Of California, BerkeleyElectrical Engineering And Computer Science
Frequently Asked Questions about Mike Stoops
What is Mike Stoops's role at the current company?
Mike Stoops's current role is Customer Quality Engineering Manager at STMicroelectronics.
What is Mike Stoops's email address?
Mike Stoops's email address is mi****@****hoo.com
What is Mike Stoops's direct phone number?
Mike Stoops's direct phone number is +412292*****
What schools did Mike Stoops attend?
Mike Stoops attended University Of California, Berkeley.
What skills is Mike Stoops known for?
Mike Stoops has skills like Semiconductors, Ic, Mixed Signal, Analog, Product Engineering, Cmos, Failure Analysis, Test Engineering, Cross Functional Team Leadership, Manufacturing, Asic, Semiconductor Industry.
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