I have a doctoral degree in Mechanical Engineering with a minor in Materials Science from Stanford University. My doctoral work was focused on developing a novel flow boiling microchannel heat exchanger to help cool high power microprocessors. After my graduate degree I joined IBM as a development engineer in the Advanced Thermal Lab led by IBM Fellow Dick Chu and then by IBM Fellow Roger Schmidt. Currently as Senior Development Engineer, I lead the thermal design and analysis for the IBM Z mainframe focusing on developing thermal management solutions that meet the cooling demands, reliability, cost and IBM's sustainability goals; I'm also responsible for studying thermal and airflow behavior through CFD and experimental analyses and also interlocking and working with key suppliers. Products supported: ZR1, z15 T02 and z16. I also lead the Advanced Technology sub-team of the Poughkeepsie Thermal Development Labs, focused on studying and developing new thermal solutions for use on servers to enable improved performance and energy efficiency, developing new metrology and manufacturing techniques for thermal commodities, generating new IP and publications, working with academic partners and pursuing and participating in Federal research programs (in collaboration with IBM Research). Finally, I also provide system level thermal design, analyses and deployment for IBM Quantum Systems including IBM System One.